Gate-Cut-Last in RMG to Enable Gate Extension Scaling and Parasitic Capacitance Reduction

A. Greene, Huimei Zhou, R. Xie, Chanro Park, L. Economikos, V. Chan, K. Akarvardar, R. Bao, I. Seshadri, R. Conti, Miaomiao Wang, M. Sankarapandian, J. Demarest, Juntao Li, Liying Jiang, K. Zhao, R. Robison, T. Ando, N. Cave, A. Knorr, D. Gupta, S. Kanakasabapathy, D. Guo, B. Haran, V. Basker, H. Bu
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引用次数: 1

Abstract

In this paper, we present for the first time a “Gate-Cut-Last” integration scheme completed within the Replacement Metal Gate (RMG) module. This novel gate cut (CT) technique allows the scaling of gate extension length past the end fin which reduces parasitic capacitance, leakage and performance variation. In addition, we demonstrate that CT-in-RMG is a promising alternative integration process that can enable scaling for future logic technology nodes. Device, circuit and reliability results are shown to compare this novel CT-in-RMG process to the conventional gate cut method.
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RMG中的栅极切割,以实现栅极扩展缩放和寄生电容减小
在本文中,我们首次提出了在替换金属门(RMG)模块中完成的“门-切割-最后”集成方案。这种新颖的栅极切割(CT)技术允许栅极延伸长度超过端鳍的缩放,从而减少寄生电容,泄漏和性能变化。此外,我们还证明了CT-in-RMG是一种很有前途的替代集成过程,可以实现对未来逻辑技术节点的扩展。器件、电路和可靠性结果表明,这种新的CT-in-RMG工艺与传统的栅极切割方法进行了比较。
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