Suhr Dominique, Mevellec Vincent, Thiam Mikailou, Idier Jonathan, Raynal Frédéric, Berthon Hermine, Perrault Elisa, Hann Nicolas, Doussot Céline, Kim Yeeseul, Baus Mathilde, Lakhdari Amine, Guittet Gaëlle, Caillard Louis
{"title":"An alternative to Tungsten in 3D-NAND technology","authors":"Suhr Dominique, Mevellec Vincent, Thiam Mikailou, Idier Jonathan, Raynal Frédéric, Berthon Hermine, Perrault Elisa, Hann Nicolas, Doussot Céline, Kim Yeeseul, Baus Mathilde, Lakhdari Amine, Guittet Gaëlle, Caillard Louis","doi":"10.1109/IITC51362.2021.9537409","DOIUrl":null,"url":null,"abstract":"As the number of wordlines has reached 128 layers in the realm of 3D-NAND, several challenges have emerged to produce these structures. Among these is metallization of the connection made with Tungsten. This paper explores Nickel alloys as an alternative metal. Several key data are presented to validate this new concept.","PeriodicalId":6823,"journal":{"name":"2021 IEEE International Interconnect Technology Conference (IITC)","volume":"11 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2021-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Interconnect Technology Conference (IITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC51362.2021.9537409","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
As the number of wordlines has reached 128 layers in the realm of 3D-NAND, several challenges have emerged to produce these structures. Among these is metallization of the connection made with Tungsten. This paper explores Nickel alloys as an alternative metal. Several key data are presented to validate this new concept.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
