{"title":"A folded bit-line architecture for high speed CMOS SRAM","authors":"Sejun Kim, I. Chang, S. Seo, K. Kwack","doi":"10.1109/ICVC.1999.820998","DOIUrl":null,"url":null,"abstract":"This paper describes a new architecture and schemes for a high speed SRAM. It is summarized as follows:1) a Folded Bit-Line Architecture (FBLA) to reduce the delay time of bit-line by decreasing the parastic capacitance, to reduce the area. 2) a Double Word-Line Activation (DWLA) technique to increase the data-rate twice and minimize row path delay, and 3) a high speed sensing scheme to decrease the delay time of the sense amplifier. To verify the above, a 8 kb SRAM was designed using 0.6 /spl mu/m CMOS technology. It realized a 600 Mbyte/s(300 M/spl times/8/spl times/2) data-rate and the die size is 2.8 mm/spl times/0.85 mm.","PeriodicalId":13415,"journal":{"name":"ICVC '99. 6th International Conference on VLSI and CAD (Cat. No.99EX361)","volume":"14 1","pages":"553-556"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ICVC '99. 6th International Conference on VLSI and CAD (Cat. No.99EX361)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICVC.1999.820998","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper describes a new architecture and schemes for a high speed SRAM. It is summarized as follows:1) a Folded Bit-Line Architecture (FBLA) to reduce the delay time of bit-line by decreasing the parastic capacitance, to reduce the area. 2) a Double Word-Line Activation (DWLA) technique to increase the data-rate twice and minimize row path delay, and 3) a high speed sensing scheme to decrease the delay time of the sense amplifier. To verify the above, a 8 kb SRAM was designed using 0.6 /spl mu/m CMOS technology. It realized a 600 Mbyte/s(300 M/spl times/8/spl times/2) data-rate and the die size is 2.8 mm/spl times/0.85 mm.