Multi-level Metallization on an Elastomer PDMS for FOWLP-based Flexible Hybrid Electronics

Zhe Wang, Ikumi Ozawa, Y. Susumago, T. Odashima, N. Takahashi, H. Kino, Tetsu Tanaka, T. Fukushima
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Abstract

In order to fabricate a wearable flexible display as a flexible hybrid electronic (FHE) device with micro-LED dies, we demonstrate multi-level metallization on an elastomer using die-first fan-out wafer-level packaging (FOWLP). The elastic substrate of this display is PDMS (polydimethylsiloxane) in which the array of 3-color micro-LEDs is embedded. In this study, we address serious issues such as die shift and stress accumulation in advanced FOWLP to integrate a self-luminescent flexible micro-LED display.
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基于fowlp的柔性混合电子弹性体PDMS的多层金属化
为了制造可穿戴柔性显示器作为具有微型led芯片的柔性混合电子(FHE)器件,我们演示了使用芯片优先扇形圆片级封装(FOWLP)在弹弹体上的多级金属化。该显示器的弹性衬底是PDMS(聚二甲基硅氧烷),其中嵌入了三色微型led阵列。在本研究中,我们解决了先进FOWLP中芯片移位和应力积累等严重问题,以集成自发光柔性微型led显示屏。
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