The via resistance analysis at ALD-to-PVD TaN transition layer

Y. Yoon, Chang-Jo Kim, Junki Jang, K. Sung, H. Kim, Yunki Choi, Jeonghoon Ahn, Won-Chull Han, W. Jang, Rakhwan Kim, Don-Jin Shin, Juheon Kim, Y. Lim, H. Yim, W. Kang, Jongmil Youn
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引用次数: 2

Abstract

We demonstrate that when a thin ALD (atomic layer deposition) TaN as a barrier metal is deposited to the Cu interconnect, the upper via resistance is significantly increased. We also exhibit that the abnormal upper via resistance is consistent with the N/Ta increase by nitrogen diffusion. To overcome this issue, we investigate a hybrid TaN (PVD TaN on the top of ALD TaN), which prevents the nitrogen diffusion to the bottom of the upper via, resulting in the improvement of the upper via resistance.
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ald - pvd TaN过渡层的通孔电阻分析
我们证明了当薄的ALD(原子层沉积)TaN作为阻挡金属沉积到Cu互连时,上通孔电阻显着增加。我们还发现,异常的上通孔电阻与氮扩散引起的N/Ta增加一致。为了克服这个问题,我们研究了一种混合TaN (ALD TaN顶部的PVD TaN),它可以防止氮扩散到上通孔底部,从而提高上通孔阻力。
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