Reliability of segmented edge seal ring for RF devices

J. Gambino, R. Graf, J. Malinowski, A. Cote, W. Guthrie, K. Watson, P. Chapman, K. K. Sims, M. D. Levy, T. Aoki, G. A. Mason, M. Jaffe
{"title":"Reliability of segmented edge seal ring for RF devices","authors":"J. Gambino, R. Graf, J. Malinowski, A. Cote, W. Guthrie, K. Watson, P. Chapman, K. K. Sims, M. D. Levy, T. Aoki, G. A. Mason, M. Jaffe","doi":"10.1109/IITC.2014.6831836","DOIUrl":null,"url":null,"abstract":"RF devices are sensitive to noise coupling between devices. One source of coupling is the edge seal ring. We propose using a segmented guard ring to reduce coupling between devices. We demonstrate that the segmented guard ring is reliable for a 0.18 μm RF technology.","PeriodicalId":6823,"journal":{"name":"2021 IEEE International Interconnect Technology Conference (IITC)","volume":"73 1","pages":"367-370"},"PeriodicalIF":0.0000,"publicationDate":"2014-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Interconnect Technology Conference (IITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2014.6831836","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

RF devices are sensitive to noise coupling between devices. One source of coupling is the edge seal ring. We propose using a segmented guard ring to reduce coupling between devices. We demonstrate that the segmented guard ring is reliable for a 0.18 μm RF technology.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
射频器件分段边缘密封圈的可靠性
射频器件对器件间的噪声耦合非常敏感。联轴器的一个来源是边缘密封圈。我们建议使用分段保护环来减少设备之间的耦合。我们证明了分段保护环对于0.18 μm射频技术是可靠的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Contact Interface Characterization of Graphene contacted MoS2 FETs Controlled ALE-type recess of molybdenum for future logic and memory applications Comparison of Copper and Cobalt Surface Reactivity for Advanced Interconnects On-die Interconnect Innovations for Future Technology Nodes Advanced CMP Process Control by Using Machine Learning Image Analysis
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1