Reliability of segmented edge seal ring for RF devices

J. Gambino, R. Graf, J. Malinowski, A. Cote, W. Guthrie, K. Watson, P. Chapman, K. K. Sims, M. D. Levy, T. Aoki, G. A. Mason, M. Jaffe
{"title":"Reliability of segmented edge seal ring for RF devices","authors":"J. Gambino, R. Graf, J. Malinowski, A. Cote, W. Guthrie, K. Watson, P. Chapman, K. K. Sims, M. D. Levy, T. Aoki, G. A. Mason, M. Jaffe","doi":"10.1109/IITC.2014.6831836","DOIUrl":null,"url":null,"abstract":"RF devices are sensitive to noise coupling between devices. One source of coupling is the edge seal ring. We propose using a segmented guard ring to reduce coupling between devices. We demonstrate that the segmented guard ring is reliable for a 0.18 μm RF technology.","PeriodicalId":6823,"journal":{"name":"2021 IEEE International Interconnect Technology Conference (IITC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2014-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Interconnect Technology Conference (IITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2014.6831836","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

RF devices are sensitive to noise coupling between devices. One source of coupling is the edge seal ring. We propose using a segmented guard ring to reduce coupling between devices. We demonstrate that the segmented guard ring is reliable for a 0.18 μm RF technology.
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射频器件分段边缘密封圈的可靠性
射频器件对器件间的噪声耦合非常敏感。联轴器的一个来源是边缘密封圈。我们建议使用分段保护环来减少设备之间的耦合。我们证明了分段保护环对于0.18 μm射频技术是可靠的。
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