Virtual Metrology Equipped with a Variability Analyzer in Chemical Mechanical Polishing

Lingyen Yeh, Shun Chun Huang
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Abstract

Virtual metrology equipped with a variability analyzer is reported. Twenty-six process variables are modeled to predict run-to-run material removal rates in chemical mechanical polishing. The mean absolute percentage error of about 0.5 % is accomplished in prediction. Factors leading to the run-to-run variations are analyzed using exploratory factor analysis. Three major factors are found and analyzed using two different approaches. The relevant process features corresponding to the factors are extracted and possible physical explanations provided. The results suggest the proposed virtual metrology is potential to analyze variability in chemical mechanical polishing and extendable to the other processes.
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基于变异性分析仪的化学机械抛光虚拟计量
本文报道了配备变异性分析仪的虚拟计量系统。建立了26个过程变量模型来预测化学机械抛光过程中材料的去除率。预测的平均绝对百分比误差约为0.5%。采用探索性因子分析方法分析了导致运行间变化的因素。使用两种不同的方法发现并分析了三个主要因素。提取了与这些因素相对应的相关过程特征,并给出了可能的物理解释。结果表明,所提出的虚拟计量具有分析化学机械抛光变异性的潜力,并可扩展到其他过程。
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