Thermodynamic evaluation of the liner and barrier properties of a single-phase interlayer for advanced Cu interconnections

Yuki Yamada, M. Yahagi, J. Koike
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Abstract

Cu interconnection would face rapid increase in resistivity due to the thick double layer of Ta/TaN. In this paper, we propose a single interlayer having dual function of liner and barrier to replace Ta/TaN. Thermodynamic simulation was employed to explore suitable interlayer materials. Key parameters for material selections included T0 curve, Cu immiscibility with the interlayer, and interface reaction between the interlayer and SiO2. The results confirmed Co–Zr and Co–Ti alloys to be potential candidates for the interlayer as experimentally reported in our previous work.
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高级铜互连用单相中间层衬里和势垒性能的热力学评价
由于Ta/TaN双层层较厚,铜互连将面临电阻率的快速增加。本文提出了一种具有内衬和屏障双重功能的单层夹层来取代Ta/TaN。采用热力学模拟方法寻找合适的夹层材料。材料选择的关键参数包括T0曲线、Cu与中间层的不混相以及中间层与SiO2的界面反应。结果证实了Co-Zr和Co-Ti合金是我们之前工作中实验报道的潜在的中间层候选者。
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