K. Nemoto, S. Ikeda, O. Yoshida, J. Sasabe, Hua Su
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引用次数: 4
Abstract
A method is described for reducing systematic defects in the initial stages of production and thereby improving yield. Statistical correlation analysis is used to find the critical process parameters that cause yield loss. Application of the proposed method to actual 300-mm wafer fabrication demonstrated that it does detect the parameters to be modified resulting in yield improvement.
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