Fei Mo, Yusaku Tagawa, C. Jin, Min-Ju Ahn, T. Saraya, T. Hiramoto, M. Kobayashi
{"title":"Experimental Demonstration of Ferroelectric HfO2 FET with Ultrathin-body IGZO for High-Density and Low-Power Memory Application","authors":"Fei Mo, Yusaku Tagawa, C. Jin, Min-Ju Ahn, T. Saraya, T. Hiramoto, M. Kobayashi","doi":"10.23919/VLSIT.2019.8776553","DOIUrl":null,"url":null,"abstract":"We have experimentally demonstrated a ferroelectric HfO2 FET with memory operation by introducing ultrathin IGZO as a channel material. Ultrathin-body IGZO ferroelectric FET (FeFET) shows high mobility with deposited channel material, nearly ideal subthreshold slope, and controllable memory characteristics with the use of back-end compatible process. These results are attributed to the properties of IGZO channel: junctionless FET operation, nearly-zero low-k interfacial layer on metal-oxide channel and good capping effect for realizing ferroelectric phase formation with HfZrO2. IGZO FeFET will open a new path for high-density memory application. Keywords: ferroelectric FET, HfO2, IGZO, memory.","PeriodicalId":6752,"journal":{"name":"2019 Symposium on VLSI Technology","volume":"104 1","pages":"T42-T43"},"PeriodicalIF":0.0000,"publicationDate":"2019-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"32","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 Symposium on VLSI Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/VLSIT.2019.8776553","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 32
Abstract
We have experimentally demonstrated a ferroelectric HfO2 FET with memory operation by introducing ultrathin IGZO as a channel material. Ultrathin-body IGZO ferroelectric FET (FeFET) shows high mobility with deposited channel material, nearly ideal subthreshold slope, and controllable memory characteristics with the use of back-end compatible process. These results are attributed to the properties of IGZO channel: junctionless FET operation, nearly-zero low-k interfacial layer on metal-oxide channel and good capping effect for realizing ferroelectric phase formation with HfZrO2. IGZO FeFET will open a new path for high-density memory application. Keywords: ferroelectric FET, HfO2, IGZO, memory.