P. Eyben, T. Chiarella, S. Kubicek, H. Bender, O. Richard, J. Mitard, A. Mocuta, N. Horiguchi, A. Thean
{"title":"用于亚10nm WFIN FinFET中3d载流子分析的手术刀软回迹扫描扩展电阻显微镜","authors":"P. Eyben, T. Chiarella, S. Kubicek, H. Bender, O. Richard, J. Mitard, A. Mocuta, N. Horiguchi, A. Thean","doi":"10.1109/IEDM.2015.7409693","DOIUrl":null,"url":null,"abstract":"Site-specific real three-dimensional (3D) carrier profiling in sub-10nm WFIN devices is demonstrated for the first time. Extension-gate overlap, active dopant concentration and distribution inside extensions and epi source/drain are observed with 1 nm-spatial resolution along X, Y and Z-directions. Using this new technique providing full 3D-carrier mapping we analyzed different processing flows for sub-10nm fin width FinFETs, identified possible failure mechanisms, and demonstrated the direct link between improved performance and 3D-carrier distribution at the nm-scale.","PeriodicalId":336637,"journal":{"name":"2015 IEEE International Electron Devices Meeting (IEDM)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Scalpel soft retrace scanning spreading resistance microscopy for 3D-carrier profiling in sub-10nm WFIN FinFET\",\"authors\":\"P. Eyben, T. Chiarella, S. Kubicek, H. Bender, O. Richard, J. Mitard, A. Mocuta, N. Horiguchi, A. Thean\",\"doi\":\"10.1109/IEDM.2015.7409693\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Site-specific real three-dimensional (3D) carrier profiling in sub-10nm WFIN devices is demonstrated for the first time. Extension-gate overlap, active dopant concentration and distribution inside extensions and epi source/drain are observed with 1 nm-spatial resolution along X, Y and Z-directions. Using this new technique providing full 3D-carrier mapping we analyzed different processing flows for sub-10nm fin width FinFETs, identified possible failure mechanisms, and demonstrated the direct link between improved performance and 3D-carrier distribution at the nm-scale.\",\"PeriodicalId\":336637,\"journal\":{\"name\":\"2015 IEEE International Electron Devices Meeting (IEDM)\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE International Electron Devices Meeting (IEDM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2015.7409693\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2015.7409693","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Scalpel soft retrace scanning spreading resistance microscopy for 3D-carrier profiling in sub-10nm WFIN FinFET
Site-specific real three-dimensional (3D) carrier profiling in sub-10nm WFIN devices is demonstrated for the first time. Extension-gate overlap, active dopant concentration and distribution inside extensions and epi source/drain are observed with 1 nm-spatial resolution along X, Y and Z-directions. Using this new technique providing full 3D-carrier mapping we analyzed different processing flows for sub-10nm fin width FinFETs, identified possible failure mechanisms, and demonstrated the direct link between improved performance and 3D-carrier distribution at the nm-scale.