M. Shulaker, G. Hills, Tony F. Wu, Zhenan Bao, H. Wong, S. Mitra
{"title":"高效金属碳纳米管的大规模去除技术","authors":"M. Shulaker, G. Hills, Tony F. Wu, Zhenan Bao, H. Wong, S. Mitra","doi":"10.1109/IEDM.2015.7409815","DOIUrl":null,"url":null,"abstract":"While carbon nanotube (CNT) field-effect transistors (CNFETs) promise to improve the performance and energy efficiency of digital systems beyond the limitations of silicon CMOS, the presence of metallic CNTs (m-CNTs) remains a major challenge. Existing techniques for removing m-CNTs are inadequate, as they face one or more of the following scalability challenges: scaling to large circuits (≥99.99% of m-CNTs must be removed without inadvertently removing semiconducting CNTs, s-CNTs), scaling to short channel lengths (for highly-scaled contacted gate pitch (CPP)), and scaling to small inter-CNT spacing (for high CNT densities required for high CNFET ION). We demonstrate a new m-CNT removal technique that, for the first time, overcomes all of these scalability challenges, as it: (a) removes ≥99.99% of m-CNTs vs. ≤1% of s-CNTs, (b) scales to any arbitrary CPP, and (c) scales to high CNT densities (≥200 CNTs/μm).","PeriodicalId":336637,"journal":{"name":"2015 IEEE International Electron Devices Meeting (IEDM)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"33","resultStr":"{\"title\":\"Efficient metallic carbon nanotube removal for highly-scaled technologies\",\"authors\":\"M. Shulaker, G. Hills, Tony F. Wu, Zhenan Bao, H. Wong, S. Mitra\",\"doi\":\"10.1109/IEDM.2015.7409815\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"While carbon nanotube (CNT) field-effect transistors (CNFETs) promise to improve the performance and energy efficiency of digital systems beyond the limitations of silicon CMOS, the presence of metallic CNTs (m-CNTs) remains a major challenge. Existing techniques for removing m-CNTs are inadequate, as they face one or more of the following scalability challenges: scaling to large circuits (≥99.99% of m-CNTs must be removed without inadvertently removing semiconducting CNTs, s-CNTs), scaling to short channel lengths (for highly-scaled contacted gate pitch (CPP)), and scaling to small inter-CNT spacing (for high CNT densities required for high CNFET ION). We demonstrate a new m-CNT removal technique that, for the first time, overcomes all of these scalability challenges, as it: (a) removes ≥99.99% of m-CNTs vs. ≤1% of s-CNTs, (b) scales to any arbitrary CPP, and (c) scales to high CNT densities (≥200 CNTs/μm).\",\"PeriodicalId\":336637,\"journal\":{\"name\":\"2015 IEEE International Electron Devices Meeting (IEDM)\",\"volume\":\"25 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"33\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE International Electron Devices Meeting (IEDM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2015.7409815\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2015.7409815","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Efficient metallic carbon nanotube removal for highly-scaled technologies
While carbon nanotube (CNT) field-effect transistors (CNFETs) promise to improve the performance and energy efficiency of digital systems beyond the limitations of silicon CMOS, the presence of metallic CNTs (m-CNTs) remains a major challenge. Existing techniques for removing m-CNTs are inadequate, as they face one or more of the following scalability challenges: scaling to large circuits (≥99.99% of m-CNTs must be removed without inadvertently removing semiconducting CNTs, s-CNTs), scaling to short channel lengths (for highly-scaled contacted gate pitch (CPP)), and scaling to small inter-CNT spacing (for high CNT densities required for high CNFET ION). We demonstrate a new m-CNT removal technique that, for the first time, overcomes all of these scalability challenges, as it: (a) removes ≥99.99% of m-CNTs vs. ≤1% of s-CNTs, (b) scales to any arbitrary CPP, and (c) scales to high CNT densities (≥200 CNTs/μm).