高k栅极堆叠中陷阱产生的检测

C. Young, D. Heh, S. Nadkarni, R. Choi, J. Peterson, H. Harris, J. Sim, S. Krishnan, J. Barnett, E. Vogel, B. Lee, P. Zeitzoff, G.A. Brown, G. Bersuker
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引用次数: 7

摘要

采用恒压应力(CVS)和电荷泵浦(CP)相结合的方法研究了SiO2 /HfO2/TiN叠层中陷阱的产生现象。通过对频率相关的CP数据的分析,我们确定了导致高k栅极堆叠中阈值电压不稳定的电压应力诱导缺陷的产生主要发生在生长的“前驱体”缺陷的界面SiO2层(IL)内,这很可能是由覆盖的HfO2层引起的。这些结果表明,IL是提高高k堆栈可靠性的主要焦点
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Detection of trap generation in high-k gate stacks
Constant voltage stress (CVS) combined with charge pumping (CP) measurements was applied to study trap generation phenomena in SiO2 /HfO2/TiN stacks. Using the analysis for frequency-dependent CP data developed to address depth profiling of the electron traps, we have determined that the voltage stress-induced generation of the defects contributing to threshold voltage instability in high-k gate stacks occurs primarily within the interfacial SiO2 layer (IL) on the as-grown "precursor" defects most likely caused by the overlaying HfO2 layer. These results point to the IL as a major focus for reliability improvement of high-k stacks
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