表面钝化技术及原位氢等离子体在GSMBE再生InP中的应用

P. Hofstra, D. A. Thompson, B. Robinson, G. Hollinger, R. Streater
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引用次数: 0

摘要

为了最大限度地减少再生长界面上的缺陷,在气源分子束外延生长的InP中,表面钝化技术与使用h等离子体的原位清洗相结合。表面通过紫外臭氧处理或单层硫钝化。经过uv -臭氧和等离子体清洗的si掺杂InP的再生界面几乎没有电活性缺陷(>)
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Application of surface passivation techniques and an in-situ hydrogen plasma for regrowth of InP by GSMBE
To minimize defects at re-grown interfaces, in InP grown by gas source molecular beam epitaxy, surface passivation techniques were combined with an in-situ cleaning using a H-plasma. Surfaces were passivated by either a UV-ozone treatment or a monolayer of sulfur. Re-grown interfaces in Si-doped InP that had been UV-ozone and plasma cleaned contained virtually no electrically active defects (<5 /spl times/ 10/sup 10/ cm/sup -2/). Re-grown interfaces in Be-doped material that had been given the same treatment contained a defect concentration of 8 /spl times/ 10/sup 11/ cm/sup -2/. Secondary ion mass spectroscopy results material that was sulfur passivated and plasma cleaned contained an interfacial defect concentration of 8 /spl times/ 10/sup 11/ cm/sup -2/.<>
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