电阻桥故障模型从常规到超深亚微米的演变

I. Polian, S. Kundu, J. Gallière, P. Engelke, M. Renovell, B. Becker
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引用次数: 48

摘要

我们提出了三种适用于不同CMOS技术的电阻式桥接故障模型。这些模型被划分为一个通用框架(由所有三个模型共享)和一个特定于技术的部分。第一种模型基于肖克利方程,适用于常规但不适用于深亚微米CMOS。第二个模型是通过拟合SPICE数据得到的。第三种电阻式桥接故障模型采用Berkeley预测技术模型和BSIM4;它适用于特征尺寸为90纳米及以下的CMOS技术,准确描述了该技术中的非平凡电气行为。ISCAS电路的实验结果表明,肖克利模型得到的测试图对拟合模型仍然有效,但在预测模型下会导致覆盖损失。
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Resistive Bridge fault model evolution from conventional to ultra deep submicron
We present three resistive bridging fault models valid for different CMOS technologies. The models are partitioned into a general framework (which is shared by all three models) and a technology-specific part. The first model is based on Shockley equations and is valid for conventional but not deep submicron CMOS. The second model is obtained by fitting SPICE data. The third resistive bridging fault model uses Berkeley predictive technology model and BSIM4; it is valid for CMOS technologies with feature sizes of 90nm and below, accurately describing non-trivial electrical behavior in that technologies. Experimental results for ISCAS circuits show that the test patterns obtained for the Shockley model are still valid for the fitted model, but lead to coverage loss under the predictive model.
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