在考虑整个晶体的情况下,用对原子间电位描述Si-O键断裂

S. Tyaginov, W. Gos, T. Grasser, V. Sverdlov, P. Schwaha, R. Heinzl, F. S. timpfl
{"title":"在考虑整个晶体的情况下,用对原子间电位描述Si-O键断裂","authors":"S. Tyaginov, W. Gos, T. Grasser, V. Sverdlov, P. Schwaha, R. Heinzl, F. S. timpfl","doi":"10.1109/IRPS.2009.5173306","DOIUrl":null,"url":null,"abstract":"We extend the McPherson model in a manner to capture the effect of the whole surrounding lattice on the siliconoxygen bond-breakage energetics. It is shown that the Mie- Grüneisen potential with the constants used in the original version of the model is not suitable under the consideration of the whole crystal. Other empirical pair-wise interatomic potentials, namely TTAM and BKS have been tested for the analysis of the bond rupture energetics. It is shown that the secondary minimum corresponding to the transition of the Si atom from the 4-fold to the 3-fold coordinated position occurs in a different direction with a rather high activation energy (~ 6 eV). The tunneling of the Si ion between the primary and the secondary minima has been treated within the WKB approximation. We demonstrate that the contribution of neighboring SiO4 tetrahedrons substantially decreases the breakage rate, making bond rupture by means of an electric field alone practically impossible. Therefore, the common action of an electric field and another contribution (bond weakening by hole capture, structural disorder and energy deposited by particles) is essential for Si-O bond-breakage.","PeriodicalId":345860,"journal":{"name":"2009 IEEE International Reliability Physics Symposium","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Description of Si-O bond breakage using pair-wise interatomic potentials under consideration of the whole crystal\",\"authors\":\"S. Tyaginov, W. Gos, T. Grasser, V. Sverdlov, P. Schwaha, R. Heinzl, F. S. timpfl\",\"doi\":\"10.1109/IRPS.2009.5173306\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We extend the McPherson model in a manner to capture the effect of the whole surrounding lattice on the siliconoxygen bond-breakage energetics. It is shown that the Mie- Grüneisen potential with the constants used in the original version of the model is not suitable under the consideration of the whole crystal. Other empirical pair-wise interatomic potentials, namely TTAM and BKS have been tested for the analysis of the bond rupture energetics. It is shown that the secondary minimum corresponding to the transition of the Si atom from the 4-fold to the 3-fold coordinated position occurs in a different direction with a rather high activation energy (~ 6 eV). The tunneling of the Si ion between the primary and the secondary minima has been treated within the WKB approximation. We demonstrate that the contribution of neighboring SiO4 tetrahedrons substantially decreases the breakage rate, making bond rupture by means of an electric field alone practically impossible. Therefore, the common action of an electric field and another contribution (bond weakening by hole capture, structural disorder and energy deposited by particles) is essential for Si-O bond-breakage.\",\"PeriodicalId\":345860,\"journal\":{\"name\":\"2009 IEEE International Reliability Physics Symposium\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-04-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.2009.5173306\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.2009.5173306","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

我们扩展了McPherson模型,以捕捉整个周围晶格对硅氧键断裂能量学的影响。结果表明,在考虑整个晶体的情况下,原模型中使用的常数Mie- gren neisen势是不合适的。其他的经验成对原子间电位,即TTAM和BKS已被测试用于分析键断裂能量。结果表明,Si原子从4重配位跃迁到3重配位所对应的次级极小值发生在不同的方向上,具有较高的活化能(~ 6 eV)。在WKB近似中处理了主极小值和次极小值之间Si离子的隧穿。我们证明了邻近的SiO4四面体的贡献大大降低了断裂率,使得仅通过电场几乎不可能破坏键。因此,电场的共同作用和另一个贡献(由空穴捕获、结构紊乱和粒子沉积的能量造成的键削弱)对于Si-O键断裂是必不可少的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Description of Si-O bond breakage using pair-wise interatomic potentials under consideration of the whole crystal
We extend the McPherson model in a manner to capture the effect of the whole surrounding lattice on the siliconoxygen bond-breakage energetics. It is shown that the Mie- Grüneisen potential with the constants used in the original version of the model is not suitable under the consideration of the whole crystal. Other empirical pair-wise interatomic potentials, namely TTAM and BKS have been tested for the analysis of the bond rupture energetics. It is shown that the secondary minimum corresponding to the transition of the Si atom from the 4-fold to the 3-fold coordinated position occurs in a different direction with a rather high activation energy (~ 6 eV). The tunneling of the Si ion between the primary and the secondary minima has been treated within the WKB approximation. We demonstrate that the contribution of neighboring SiO4 tetrahedrons substantially decreases the breakage rate, making bond rupture by means of an electric field alone practically impossible. Therefore, the common action of an electric field and another contribution (bond weakening by hole capture, structural disorder and energy deposited by particles) is essential for Si-O bond-breakage.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Life-stress relationship for thin film transistor gate line interconnects on flexible substrates The mechanism of device damage during bump process for flip-chip package Very fast transient simulation and measurement methodology for ESD technology development Field effect diode for effective CDM ESD protection in 45 nm SOI technology Reliability challenges for power devices under active cycling
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1