S.T. Liu, D. Ioannou, D. Ioannou, M. Flanery, H. Hughes
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引用次数: 6
摘要
在本文中,我们描述了部分耗尽(PD) SOI mosfet从0.35和0.15 /spl mu/m技术中选择的NBTI测试和报告结果,用于恶劣环境(即空间,高温等)应用。当研究“纯”NBTI降解时,我们发现结果与本体技术相似,并且与NBTI的标准反应扩散(R-D)理论很好地吻合。然而,当栅极和漏极都偏置时,如在热载流子注入(HCI)降解情况下,观察到HCI和NBTI的有趣相互作用,从而解决了具有薄栅极氧化物的p沟道SOI mosfet的最坏情况HCI应力条件问题。
NBTI in SOI p-channel MOS field effect transistors
In this paper we describe NBTI tests and report results for partially depleted (PD) SOI MOSFETs selected from 0.35 and 0.15 /spl mu/m technologies for harsh environment (i.e., space, high temperature, etc.) applications. When studying "pure" NBTI degradation, we find that the results are similar to bulk technologies, and in good agreement with the standard reaction-diffusion (R-D) theory of NBTI. However, when both gate and drain are biased as in a hot carrier injection (HCI) degradation situation, an interesting interaction of HCI and NBTI is observed, which leads to the resolution of the question of worst case HCI stress conditions for p-channel SOI MOSFETs with thin gate oxides.