{"title":"MEMS封装领域概述及发展趋势","authors":"H. Reichl, V. Grosser","doi":"10.1109/MEMSYS.2001.906464","DOIUrl":null,"url":null,"abstract":"Micro Electro Mechanical Systems (MEMS) packaging is expensive and product and application specific. Single chip packages for IC's are only for some microsystems applicable. Cost efficient MEMS packaging focuses wafer level packaging (WLP). An identical trend is observed in IC packaging. Chip size packages (CSP) are fabricated by WLP. Future microelectronic system will be fabricated by wafer level assembly of multiple components on a base chip. System on package (SOP) techniques including 3D cubic integration will be used. For MEMS packaging a Modular MEMS system integration (MOMEMS) is proposed. Cubic integration by stacking of CSP packaged MEMS modules contribute to an economic realization of low volume microsystems.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"91","resultStr":"{\"title\":\"Overview and development trends in the field of MEMS packaging\",\"authors\":\"H. Reichl, V. Grosser\",\"doi\":\"10.1109/MEMSYS.2001.906464\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Micro Electro Mechanical Systems (MEMS) packaging is expensive and product and application specific. Single chip packages for IC's are only for some microsystems applicable. Cost efficient MEMS packaging focuses wafer level packaging (WLP). An identical trend is observed in IC packaging. Chip size packages (CSP) are fabricated by WLP. Future microelectronic system will be fabricated by wafer level assembly of multiple components on a base chip. System on package (SOP) techniques including 3D cubic integration will be used. For MEMS packaging a Modular MEMS system integration (MOMEMS) is proposed. Cubic integration by stacking of CSP packaged MEMS modules contribute to an economic realization of low volume microsystems.\",\"PeriodicalId\":311365,\"journal\":{\"name\":\"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-01-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"91\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MEMSYS.2001.906464\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.2001.906464","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Overview and development trends in the field of MEMS packaging
Micro Electro Mechanical Systems (MEMS) packaging is expensive and product and application specific. Single chip packages for IC's are only for some microsystems applicable. Cost efficient MEMS packaging focuses wafer level packaging (WLP). An identical trend is observed in IC packaging. Chip size packages (CSP) are fabricated by WLP. Future microelectronic system will be fabricated by wafer level assembly of multiple components on a base chip. System on package (SOP) techniques including 3D cubic integration will be used. For MEMS packaging a Modular MEMS system integration (MOMEMS) is proposed. Cubic integration by stacking of CSP packaged MEMS modules contribute to an economic realization of low volume microsystems.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
