Al/n-InP触点快速热退火后不均匀反应和肖特基势垒变化的微观分析

T. Lin, H. Kaibe, C. Kaneshiro, S. Miyazaki, T. Okumura
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引用次数: 1

摘要

虽然金属与氧化n-InP的接触表现出相对较高的肖特基势垒高度,但由于界面反应可能使氧化物解离,它们在热退火后不稳定。作者介绍了Al/n-InP触点在快速热退火后电学性能的变化与界面反应的关系。在一定的退火温度范围内,获得了具有接近0.7 eV的高肖特基势垒高度的整流触点,通过电子探针微分析和扫描内光电显微镜对其进行了成分和电性微分析。对结果进行了讨论。
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Microanalysis of inhomogeneous reaction and Schottky-barrier change of Al/n-InP contacts upon rapid thermal annealing
Although metal contacts to oxidized n-InP show relatively high Schottky-barrier height, they will not be stable upon thermal annealing since the interfacial reaction might dissociate the oxides. The authors present the change in electrical properties of Al/n-InP contacts upon the rapid thermal annealing in relation to the interfacial reaction. In a certain range of the annealing temperature, a rectifying contact was obtained with a high Schottky-barrier height close to 0.7 eV, for which compositional and electrical microanalysis were carried out by means of the electron-probe microanalysis and the scanning internal-photoemission microscopy. The results are discussed.<>
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