J.T.C. Chen, T. Dimitrova, D. Dimitrov, K. Park, D. Schroder
{"title":"V/sub BD/和Q/sub BD/测试的一些应用","authors":"J.T.C. Chen, T. Dimitrova, D. Dimitrov, K. Park, D. Schroder","doi":"10.1109/IRWS.2005.1609582","DOIUrl":null,"url":null,"abstract":"Much work has been done and many papers have been published on gate oxide integrity. The work is largely concentrated on characterization, modeling of oxide degradation and breakdown under stress and measurement techniques. With such extended knowledge and techniques on oxide reliability available, we can make use of that for monitoring wafer quality and process equipment. Here we show that VBD measurements reflect different aspect of oxide characteristics from QBD measurements and each can be used for its corresponding monitoring applications","PeriodicalId":214130,"journal":{"name":"2005 IEEE International Integrated Reliability Workshop","volume":"114 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Some applications of V/sub BD/ and Q/sub BD/ tests\",\"authors\":\"J.T.C. Chen, T. Dimitrova, D. Dimitrov, K. Park, D. Schroder\",\"doi\":\"10.1109/IRWS.2005.1609582\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Much work has been done and many papers have been published on gate oxide integrity. The work is largely concentrated on characterization, modeling of oxide degradation and breakdown under stress and measurement techniques. With such extended knowledge and techniques on oxide reliability available, we can make use of that for monitoring wafer quality and process equipment. Here we show that VBD measurements reflect different aspect of oxide characteristics from QBD measurements and each can be used for its corresponding monitoring applications\",\"PeriodicalId\":214130,\"journal\":{\"name\":\"2005 IEEE International Integrated Reliability Workshop\",\"volume\":\"114 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-10-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 IEEE International Integrated Reliability Workshop\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRWS.2005.1609582\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 IEEE International Integrated Reliability Workshop","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRWS.2005.1609582","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Some applications of V/sub BD/ and Q/sub BD/ tests
Much work has been done and many papers have been published on gate oxide integrity. The work is largely concentrated on characterization, modeling of oxide degradation and breakdown under stress and measurement techniques. With such extended knowledge and techniques on oxide reliability available, we can make use of that for monitoring wafer quality and process equipment. Here we show that VBD measurements reflect different aspect of oxide characteristics from QBD measurements and each can be used for its corresponding monitoring applications