带探针封装的DDR5片上SI/PI的高级测量与仿真方法

2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2022-10-09 DOI:10.1109/EPEPS53828.2022.9947122

Wonsuk Choi, S. Kwak, Jaeseok Park, Jiyoung Do, Byeongseon Yun, Yoo-Jeong Kwon, Dongho Kim, Kyu-Sik Lee, Tae Young Kim, Wonyoung Kim, Kyoungsun Kim, Sung Joo Park, Jeonghyeon Cho, H. Song

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摘要

随着服务器系统运行速度的加快，信号完整性(SI)和功率完整性(PI)的测量方法和dual - in - line memory module (DIMM)产品的建模变得越来越重要。本文介绍了基于DDR5探测封装开发的片上SI/PI测量和DRAM信号恢复的先进方法。与传统的中介器相比，一种新的探测封装方法被证明具有高速信号测量和信号恢复的优势，它也可以作为DRAM片上SI测量和信号预测的有用工具，在DDR5之后的速度(超过6.4 Gbps)。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Advanced Measurement and Simulation Approach for DDR5 On-chip SI/PI with the Probing Package

As the operation of server system is accelerated, the importance of signal integrity (SI) and power integrity (PI) measurement methodology and modeling of dual in line memory module (DIMM) products is increasing. In this paper, we introduce the advanced methodology for on-chip SI/PI measurement and DRAM signal recovery with the DDR5 probing package development. Comparing with the conventional interposer, a new method of probing package has proved to be advantageous for high-speed signal measurement and signal recovery, and it can also be used as a useful tool for DRAM on-chip SI measurement and signal prediction in post DDR5 speed (beyond 6.4 Gbps).

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2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

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