半绝缘GaAs的铸锭和晶片退火效应的光致发光研究

O. Ka, O. Oda, Y. Makita, A. Yamada
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引用次数: 0

摘要

采用光致发光光谱法对半绝缘齐克拉尔斯基生长砷化镓进行了表征。光谱显示了不同的生长后退火工艺所引起的差异,即锭退火或片退火,单步退火或多步退火。晶圆退火技术确实可以改善晶体质量,而锭退火晶体则存在额外的缺陷-发射。对于多步锭退火晶体,与78-meV双受体缺陷不同的是,在1.45 eV左右的两个转变被鉴定为(e,A/spl环/)和(D/spl环/,A/spl环/)类受体缺陷的重组。另一方面,晶圆退火晶体呈现出低浓度的背景杂质,通过选择性对发光估计。
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Photolumineseence investigation of ingot- and wafer-annealing effects on semi-insulating GaAs
Photoluminescence spectroscopy is used to characterize semi-insulating Czochralski-grown GaAs. The spectra show the differences induced by the different post growth annealing procedures, i.e. ingot- or wafer-annealing, single- or multi-step. The wafer annealing techniques definitely lead to an improvement of the crystalline quality, while ingot annealed crystals present additional defect related-emissions. For multi-step ingot-annealed crystals, two transitions around 1.45 eV are identified with the (e,A/spl ring/) and the (D/spl ring/,A/spl ring/) recombinations of an acceptor-like defect, different from the 78-meV double acceptor. On the other hand, wafer-annealed crystals present much lower concentrations of background impurities, as estimated by selective pair luminescence.
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