Be/P共注入改善Al/InP肖特基屏障

R. Tyagi, T. Chow, J. Borrego, K.A. Pisarczyk
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引用次数: 8

摘要

传统的InP MESFET技术的发展受到InP中由于表面费米能级钉钉而获得的低势垒高度(0.3-0.4eV)以及由此产生的高反向泄漏电流的严重阻碍。因此,几种技术被应用于增加n-InP上的肖特基势垒高度。作者提出了一种利用Be/P共注入在n-InP上获得改进Al/InP肖特基势垒的方法。已获得高达0.64 eV的肖特基势垒高度,以及非常接近于统一的理想因子。反漏电流密度也降低了近4个数量级。
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Improved Al/InP Schottky barriers by coimplantation of Be/P
The development of conventional InP MESFET technology is strongly hampered by the low barrier height (0.3-0.4eV) obtained in InP, due to surface Fermi level pinning, and consequent high reverse leakage currents. As a result, several techniques are being applied to increase the Schottky barrier height on n-InP. The authors present a technique for obtaining improved Al/InP Schottky barriers on n-InP by using coimplantation of Be/P. Schottky barrier heights as high as 0.64 eV have been obtained, along with an ideality factor very close to unity. The reverse leakage current density is also reduced by almost four orders of magnitude.<>
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