一种带有微弹簧触点阵列的热机械继电器

Y. Liu, X. Li, T. Abe, Y. Haga, M. Esashi
{"title":"一种带有微弹簧触点阵列的热机械继电器","authors":"Y. Liu, X. Li, T. Abe, Y. Haga, M. Esashi","doi":"10.1109/MEMSYS.2001.906518","DOIUrl":null,"url":null,"abstract":"A micromachined thermomechanical relay with Au microspring contact array is presented. Thermally excited Al-SiO/sub 2/ bimorph cantilevers have been fabricated with micromachining technology. Sputtered Au/Pt/Ti contacts are formed on the tip of the cantilevers and microheaters are built in the cantilevers. In order to reduce the ON-resistance and to avoid the metallic binding between Au contacts, Au microspring contact array is fabricated on Pyrex glass. The fabricated thermomechanical microrelay is operated with input power levels ranging from 20-80 mW at frequencies up to 3 kHz. The ON resistance R/sub ON/, that includes contact resistance and signal line resistance is in the range of 200-500 m/spl Omega/ and switching time is about 300 /spl mu/sec. 10/sup 7/ cycles operation has been performed keeping the R/sub ON/ around 300 m/spl Omega/.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"32","resultStr":"{\"title\":\"A thermomechanical relay with microspring contact array\",\"authors\":\"Y. Liu, X. Li, T. Abe, Y. Haga, M. Esashi\",\"doi\":\"10.1109/MEMSYS.2001.906518\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A micromachined thermomechanical relay with Au microspring contact array is presented. Thermally excited Al-SiO/sub 2/ bimorph cantilevers have been fabricated with micromachining technology. Sputtered Au/Pt/Ti contacts are formed on the tip of the cantilevers and microheaters are built in the cantilevers. In order to reduce the ON-resistance and to avoid the metallic binding between Au contacts, Au microspring contact array is fabricated on Pyrex glass. The fabricated thermomechanical microrelay is operated with input power levels ranging from 20-80 mW at frequencies up to 3 kHz. The ON resistance R/sub ON/, that includes contact resistance and signal line resistance is in the range of 200-500 m/spl Omega/ and switching time is about 300 /spl mu/sec. 10/sup 7/ cycles operation has been performed keeping the R/sub ON/ around 300 m/spl Omega/.\",\"PeriodicalId\":311365,\"journal\":{\"name\":\"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-01-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"32\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MEMSYS.2001.906518\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.2001.906518","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 32

摘要

介绍了一种采用金微弹簧触点阵列的微机械热机械继电器。采用微机械加工技术制备了热激发Al-SiO/sub - 2/双晶圆悬臂梁。在悬臂梁顶端形成Au/Pt/Ti溅射触点,并在悬臂梁中安装微加热器。为了降低导通电阻,避免金触点之间的金属结合,在热玻璃上制作了金微弹簧触点阵列。制造的热机械微继电器的输入功率范围为20-80 mW,频率高达3 kHz。导通电阻R/sub ON/,包括接触电阻和信号线电阻,在200-500 m/spl ω /范围内,开关时间约为300 /spl mu/sec。已经执行了10/sup / 7/循环操作,使R/sub保持在300米/spl ω /左右。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
A thermomechanical relay with microspring contact array
A micromachined thermomechanical relay with Au microspring contact array is presented. Thermally excited Al-SiO/sub 2/ bimorph cantilevers have been fabricated with micromachining technology. Sputtered Au/Pt/Ti contacts are formed on the tip of the cantilevers and microheaters are built in the cantilevers. In order to reduce the ON-resistance and to avoid the metallic binding between Au contacts, Au microspring contact array is fabricated on Pyrex glass. The fabricated thermomechanical microrelay is operated with input power levels ranging from 20-80 mW at frequencies up to 3 kHz. The ON resistance R/sub ON/, that includes contact resistance and signal line resistance is in the range of 200-500 m/spl Omega/ and switching time is about 300 /spl mu/sec. 10/sup 7/ cycles operation has been performed keeping the R/sub ON/ around 300 m/spl Omega/.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Electrostatic impact-drive microactuator High-density 3D packaging technology for CCD micro-camera system module High throughput optical near-field aperture array for data storage Device transplant of optical MEMS for out of plane beam steering Performance of a MEMS based micro capillary pumped loop for chip-level temperature control
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1