热选择MRAM具有2位单元能力,适用于65nm以上的技术节点

R. Leuschner, U. Klostermann, H. Park, F. Dahmani, R. Dittrich, C. Grigis, K. Hernan, S. Mege, C. Park, M. C. Clech, G. Y. Lee, S. Bournat, L. Altimime, G. Mueller
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引用次数: 10

摘要

我们报道了一种具有多层编程能力的新型热选择(TS) MRAM。利用无磁层(FL)的交换偏置钉钉实现了热稳定的钻头并减小了写入电流。本报告展示了ts基磁隧道结(MTJ)的实验数据,其尺寸为50 × 90 nm2,是迄今为止报道的最小尺寸。在70 × 140 nm2的MTJ上还演示了每1晶体管和1MTJ (1T1MTJ)具有2位的多电平能力。采用先进的2位单元概念,可以在65纳米技术节点上实现70%的有效比特密度增加
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Thermal Select MRAM with a 2-bit Cell Capability for beyond 65 nm Technology Node
We report on a novel thermal select (TS) MRAM with multilevel programming capability. Exchange bias pinning of a magnetic free layer (FL) was used to achieve a thermally stable bit and to reduce writing currents. This report shows experimental data for a TS-based magnetic tunnel junction (MTJ) with a size of 50 times90 nm2, the smallest size reported so far. Multilevel capability with 2 bits per 1-transistor and 1-MTJ (1T1MTJ) is also demonstrated on a 70 times 140 nm2 MTJ. With the advanced 2-bit cell concept, a 70% increase in effective bit density can be achieved at 65 nm technology node
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