Yueying Liu, John Wood, Zongyang Hu, S. Ganguly, J. Fisher, M. Watts, S. Sheppard, D. Gajewski, Basim Noori
{"title":"5G GaN hemt设计与建模","authors":"Yueying Liu, John Wood, Zongyang Hu, S. Ganguly, J. Fisher, M. Watts, S. Sheppard, D. Gajewski, Basim Noori","doi":"10.1109/IRPS48203.2023.10117652","DOIUrl":null,"url":null,"abstract":"As GaN on SiC technology becomes accessible to commercial users for 5G applications, modeling needs from transistor to system level has become a big challenge for designers. In this work we demonstrated the strategy of using multi-physics modeling for a high power GaN HEMT PA design to achieve the stringent design target goal on the product level. The simulation result shows excellent agreement between measurements and models. Meanwhile, to facilitate the design process at system level, behavioral modeling is used to predict module level performance by integrating models in complex signal scheme environment. The final product used with Wolfspeed's 5G targeted process with reliability test validity is demonstrated in the paper as well.","PeriodicalId":159030,"journal":{"name":"2023 IEEE International Reliability Physics Symposium (IRPS)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"GaN HEMTs Design and Modeling for 5G\",\"authors\":\"Yueying Liu, John Wood, Zongyang Hu, S. Ganguly, J. Fisher, M. Watts, S. Sheppard, D. Gajewski, Basim Noori\",\"doi\":\"10.1109/IRPS48203.2023.10117652\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As GaN on SiC technology becomes accessible to commercial users for 5G applications, modeling needs from transistor to system level has become a big challenge for designers. In this work we demonstrated the strategy of using multi-physics modeling for a high power GaN HEMT PA design to achieve the stringent design target goal on the product level. The simulation result shows excellent agreement between measurements and models. Meanwhile, to facilitate the design process at system level, behavioral modeling is used to predict module level performance by integrating models in complex signal scheme environment. The final product used with Wolfspeed's 5G targeted process with reliability test validity is demonstrated in the paper as well.\",\"PeriodicalId\":159030,\"journal\":{\"name\":\"2023 IEEE International Reliability Physics Symposium (IRPS)\",\"volume\":\"23 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 IEEE International Reliability Physics Symposium (IRPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS48203.2023.10117652\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE International Reliability Physics Symposium (IRPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS48203.2023.10117652","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
摘要
随着5G应用的商业用户可以使用GaN on SiC技术,从晶体管到系统级的建模需求已成为设计人员面临的一大挑战。在这项工作中,我们展示了在高功率GaN HEMT PA设计中使用多物理场建模的策略,以在产品层面上实现严格的设计目标。仿真结果表明,实测数据与模型吻合良好。同时,为了方便系统级的设计过程,通过对复杂信号方案环境下的模型进行集成,利用行为建模来预测模块级的性能。文中还展示了Wolfspeed 5G目标工艺的最终产品,并进行了信度测试效度的验证。
As GaN on SiC technology becomes accessible to commercial users for 5G applications, modeling needs from transistor to system level has become a big challenge for designers. In this work we demonstrated the strategy of using multi-physics modeling for a high power GaN HEMT PA design to achieve the stringent design target goal on the product level. The simulation result shows excellent agreement between measurements and models. Meanwhile, to facilitate the design process at system level, behavioral modeling is used to predict module level performance by integrating models in complex signal scheme environment. The final product used with Wolfspeed's 5G targeted process with reliability test validity is demonstrated in the paper as well.