飞秒CMOS技术与高k偏移间隔和富氧界面的SiN栅极电介质

R. Tsuchiya, K. Ohnishi, M. Horiuchi, S. Tsujikawa, Y. Shimamoto, N. Inada, J. Yugami, F. Ootsuka, T. Onai
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引用次数: 15

摘要

我们为70纳米技术节点展示了40纳米CMOS晶体管。该晶体管使用高k偏移间隔器(EOS:高epsilon偏移间隔器)实现短通道和高驱动性,以及具有富氧界面(OI-SiN)的SiN栅极介电体来抑制栅极泄漏电流和硼渗透。因此,N-MOSFET和P-MOSFET分别具有0.68和0.30 mA//spl mu/m的高驱动电流,I/sub off =10 nA//spl mu/m, EOT值为1.4 nm。对于栅极长度为19 nm的N-MOSFET,也实现了280 fs (3.6 THz)的栅极延迟记录。
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Femto-second CMOS technology with high-k offset spacer and SiN gate dielectric with oxygen-enriched interface
We demonstrate 40-nm CMOS transistors for the 70-nm technology node. This transistor uses a high-k offset spacer (EOS: high-epsilon offset spacer) in achieving both a short-channel and high drivability along with SiN gate dielectrics with oxygen-enriched interface (OI-SiN) to suppress both the gate-leakage current and boron penetration. Consequently, N-MOSFET and P-MOSFET have high drive currents of 0.68 and 0.30 mA//spl mu/m, respectively, with I/sub off/=10 nA//spl mu/m, with an EOT value of 1.4 nm. The record gate delay of 280 fs (3.6 THz), for an N-MOSFET with the gate length of 19 nm, has also been achieved.
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