T. Miyata, H. Tanaka, K. Kagimoto, M. Kamiyashiki, M. Kamimura, A. Hidaka, M. Goto, K. Adachi, A. Hokazono, T. Ohguro, K. Nagaoka, Y. Watanabe, S. Hirooka, Y. Ito, S. Kawanaka, K. Ishimaru
{"title":"采用多栅极氧化物双工作功能(MGO-DWF)-MO场效应晶体管,具有高抗漏击穿电压的150 GHz FMAX","authors":"T. Miyata, H. Tanaka, K. Kagimoto, M. Kamiyashiki, M. Kamimura, A. Hidaka, M. Goto, K. Adachi, A. Hokazono, T. Ohguro, K. Nagaoka, Y. Watanabe, S. Hirooka, Y. Ito, S. Kawanaka, K. Ishimaru","doi":"10.1109/IEDM.2015.7409769","DOIUrl":null,"url":null,"abstract":"We propose Multi Gate Oxide - Dual Work-Function (MGO-DWF)-MOSFET which is suitable for low power AB-class RF power amplifier (RF PA). This was examined for the first time by comparing with a standard Cascode connection circuitry composed of LV- and HVMOSFETs. Dramatically improved FMAX (150 GHz) with sufficient drain break-down voltage (VBD) was experimentally confirmed in a practical device structure. MGO-DWF-MOSFET has multiple roles in a unit device such as LV-MOSFET in source side regions and HV-MOSFET in drain side regions. This distinctive structure enables the reduction of the device area and a gate capacitance (CG) with a higher transconductance (GM) and the suppression of drain conductance (GDS). Enhancement of FMAX, in other words, DC operation current reduction is achieved at a given operation point. This indicates that MGO-DWF MOSFET is advantageous for low power amplifier circuitry applications, typically for RF PA in internet of things (IoT) products.","PeriodicalId":336637,"journal":{"name":"2015 IEEE International Electron Devices Meeting (IEDM)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"150 GHz FMAX with high drain breakdown voltage immunity by multi gate oxide dual work-function (MGO-DWF)-MO SFET\",\"authors\":\"T. Miyata, H. Tanaka, K. Kagimoto, M. Kamiyashiki, M. Kamimura, A. Hidaka, M. Goto, K. Adachi, A. Hokazono, T. Ohguro, K. Nagaoka, Y. Watanabe, S. Hirooka, Y. Ito, S. Kawanaka, K. Ishimaru\",\"doi\":\"10.1109/IEDM.2015.7409769\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We propose Multi Gate Oxide - Dual Work-Function (MGO-DWF)-MOSFET which is suitable for low power AB-class RF power amplifier (RF PA). This was examined for the first time by comparing with a standard Cascode connection circuitry composed of LV- and HVMOSFETs. Dramatically improved FMAX (150 GHz) with sufficient drain break-down voltage (VBD) was experimentally confirmed in a practical device structure. MGO-DWF-MOSFET has multiple roles in a unit device such as LV-MOSFET in source side regions and HV-MOSFET in drain side regions. This distinctive structure enables the reduction of the device area and a gate capacitance (CG) with a higher transconductance (GM) and the suppression of drain conductance (GDS). Enhancement of FMAX, in other words, DC operation current reduction is achieved at a given operation point. This indicates that MGO-DWF MOSFET is advantageous for low power amplifier circuitry applications, typically for RF PA in internet of things (IoT) products.\",\"PeriodicalId\":336637,\"journal\":{\"name\":\"2015 IEEE International Electron Devices Meeting (IEDM)\",\"volume\":\"42 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE International Electron Devices Meeting (IEDM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2015.7409769\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2015.7409769","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
150 GHz FMAX with high drain breakdown voltage immunity by multi gate oxide dual work-function (MGO-DWF)-MO SFET
We propose Multi Gate Oxide - Dual Work-Function (MGO-DWF)-MOSFET which is suitable for low power AB-class RF power amplifier (RF PA). This was examined for the first time by comparing with a standard Cascode connection circuitry composed of LV- and HVMOSFETs. Dramatically improved FMAX (150 GHz) with sufficient drain break-down voltage (VBD) was experimentally confirmed in a practical device structure. MGO-DWF-MOSFET has multiple roles in a unit device such as LV-MOSFET in source side regions and HV-MOSFET in drain side regions. This distinctive structure enables the reduction of the device area and a gate capacitance (CG) with a higher transconductance (GM) and the suppression of drain conductance (GDS). Enhancement of FMAX, in other words, DC operation current reduction is achieved at a given operation point. This indicates that MGO-DWF MOSFET is advantageous for low power amplifier circuitry applications, typically for RF PA in internet of things (IoT) products.