IIRW 2005 discussion group summary: product reliability

The group reported that they are using a variety of times, commonly ranging from 5-10 hours, to 24 hours, to as long as 160 hours. The longer times were generally used in high-reliability applications or in situations where companies continue to follow the MIL-STD procedures. The group felt that 160 hours was overkill for most applications. The typical burn-in temperature among the companies represented in the discussion is 125degC to 140degC. In some cases, product burn-in times are reduced as the process and product matures and more field history is accumulated. There were no specific criteria given for how the process is managed, nor what data are required to achieve a reduced time. Many companies use per-product burn-in times, with starting point conditions based upon historical precedent, or upon market segment (e.g. commercial, automotive, industrial). For embedded DRAM, voltage screen at IC probe is used instead of burn-in