采用直接隧道模式(12/spl sim/ 16a)栅极氧化物,对亚100nm CMOS器件的界面陷阱进行了新的直接测定

S.S. Chung, S.-J. Chen, C.K. Yang, S.M. Cheng, S.H. Lin, Y.C. Sheng, H. Lin, K.-T. Hung, D.Y. Wu, T. Yew, S. Chien, F. Liou, F. Wen
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引用次数: 20

摘要

本文首次实现了一种改进的电荷泵浦(CP)方法,用于直接隧道作用下超薄栅极氧化物的超短栅长CMOS器件的界面陷阱的直接测定。12- 16a栅极氧化物中的泄漏电流可以从测量的CP电流中去除,从而可以准确地确定界面陷阱。该方法已成功地用于各种快速热氧化氮(RTNO)生长和远程等离子体氮化(RPN)处理的极薄栅极氧化物氧化物氧化物CMOS器件。此外,它还可以作为超薄栅氧化过程的良好监测和与界面陷阱产生有关的器件可靠性评估。
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A novel and direct determination of the interface traps in sub-100 nm CMOS devices with direct tunneling regime (12/spl sim/16 A) gate oxide
For the first time, an improved charge pumping (CP) method has been implemented for direct determination of the interface traps in ultra-short gate length CMOS devices with ultra-thin gate oxide in the direct tunneling regime. The leakage current in a 12-16 A gate oxide can be removed from the measured CP current, which enables accurate determination of the interface traps. This method has been demonstrated successfully for various rapid thermal nitric oxide (RTNO) grown and remote plasma nitridation (RPN) treated oxide CMOS devices with very thin gate oxide. Moreover, it can be used as a good monitor of ultra-thin gate oxide process and the evaluations of device reliabilities in relating to the interface trap generation.
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