位错增强扩散在异外延GaInP/InP:S中的应用

A. Bensaada, R. Cochrane, R. Masut
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引用次数: 1

摘要

在低压MOCVD生长过程中,硫从高掺杂(n/spl sim/10/sup 19/ cm/sup -3/) InP:S(001)衬底扩散到名义上未掺杂的Ga/sub x/In/sub 1-x/P (0/spl les/x/spl les/0.2)薄膜中。利用高分辨率x射线衍射研究了样品的组成、弛豫和位错密度,并利用C-V电化学谱仪获得了深入的掺杂谱。分析结果表明,随着样品中Ga含量(/spl sim/1 /spl mu/m)的增加,硫从基体中扩散的速度加快。这种增强是最初由失配引起的越来越多的位错产生的结果。在结构缺陷中,硫原子的扩散系数(D/sub D/)比未位错材料的扩散系数(D/sub l/)高6个数量级。推导出了生长温度为640/spl℃时的D/sub / lspl / sim/2/spl × /10/sup -17/ cm/sup / 2s的值。
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Dislocation-enhanced diffusion in heteroepitaxial GaInP/InP:S
We characterize sulfur diffusion from heavily doped (n/spl sim/10/sup 19/ cm/sup -3/) InP:S (001) substrates into nominally undoped Ga/sub x/In/sub 1-x/P (0/spl les/x/spl les/0.2) epilayers during growth by low-pressure MOCVD. The composition, relaxation and dislocation density of the samples have been studied by high resolution X-ray diffraction and in-depth doping profiles have been obtained using a C-V electrochemical profiler. The analysis of these profiles shows that as the Ga content of these thick (/spl sim/1 /spl mu/m) samples is increased, a rapid enhancement of the sulfur diffusion from the substrate is observed. This enhancement is a consequence of the generation of an increasing number of dislocations initially caused by the mismatch. The structural defects act as pipes inside which the diffusion coefficient (D/sub d/) of sulfur atoms is calculated to be 6 orders of magnitude higher than that of the undislocated material (D/sub l/). Value of D/sub lspl sim/2/spl times/10/sup -17/ cm/sup 2s at the growth temperature of 640/spl deg/C have been deduced.<>
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