高性能MRAM技术与改进的磁性隧道结材料

M. Motoyoshi, K. Moriyama, H. Mori, C. Fukumoto, H. Itoh, H. Kano, K. Bessho, H. Narisawe
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引用次数: 5

摘要

本文是一篇关于高性能MRAM技术的研究报告。0.4/spl次/0.8 /spl mu/m/sup 2/ MTJ元件在0.35 /spl mu/m CMOS技术下成功集成,无工艺损伤。通过引入改进的磁隧道结(MTJ)材料,获得了大于55%的磁电阻(MR)比和读/写工作点。短脉冲写入与改进的单元结构相结合,表明MRAM在低功耗应用方面具有很大的潜力。
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High-performance MRAM technology with an improved magnetic tunnel junction material
This work is a report on high-performance MRAM technology. 0.4/spl times/0.8 /spl mu/m/sup 2/ MTJ elements were successfully integrated with 0.35 /spl mu/m CMOS technology without process-induced damage. A magnetoresistance (MR) ratio of more than 55% and the read/write operating point were obtained by introducing an improved magnetic tunnel junction (MTJ) material. The short-pulse writing in combination with an improved cell structure suggests that MRAM has a great deal of potential for low power applications.
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