等温电迁移试验中Cu-damascene结构的电阻不稳定性

2005 IEEE International Integrated Reliability Workshop Pub Date : 2005-10-17 DOI:10.1109/IRWS.2005.1609584

M. Impronta, S. Farris, A. Ficola, A. Scorzoni

{"title":"等温电迁移试验中Cu-damascene结构的电阻不稳定性","authors":"M. Impronta, S. Farris, A. Ficola, A. Scorzoni","doi":"10.1109/IRWS.2005.1609584","DOIUrl":null,"url":null,"abstract":"The isothermal test is a promising wafer-level tool to characterize electromigration also in Cu-damascene metallizations, when a correct temperature determination is employed. In this work an improved feedback algorithm is proposed to reduce the observed resistance instability in the stress phase, when the copper structures are approaching the failure","PeriodicalId":214130,"journal":{"name":"2005 IEEE International Integrated Reliability Workshop","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Resistance instability in Cu-damascene structures during the isothermal electromigration test\",\"authors\":\"M. Impronta, S. Farris, A. Ficola, A. Scorzoni\",\"doi\":\"10.1109/IRWS.2005.1609584\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The isothermal test is a promising wafer-level tool to characterize electromigration also in Cu-damascene metallizations, when a correct temperature determination is employed. In this work an improved feedback algorithm is proposed to reduce the observed resistance instability in the stress phase, when the copper structures are approaching the failure\",\"PeriodicalId\":214130,\"journal\":{\"name\":\"2005 IEEE International Integrated Reliability Workshop\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-10-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 IEEE International Integrated Reliability Workshop\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRWS.2005.1609584\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 IEEE International Integrated Reliability Workshop","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRWS.2005.1609584","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

当采用正确的温度测定时，等温测试是一种很有前途的晶圆级工具，可以表征铜-大马士革金属化中的电迁移。本文提出了一种改进的反馈算法，以减少铜结构在应力阶段接近破坏时所观察到的电阻失稳

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

Resistance instability in Cu-damascene structures during the isothermal electromigration test

The isothermal test is a promising wafer-level tool to characterize electromigration also in Cu-damascene metallizations, when a correct temperature determination is employed. In this work an improved feedback algorithm is proposed to reduce the observed resistance instability in the stress phase, when the copper structures are approaching the failure

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2005 IEEE International Integrated Reliability Workshop

自引率

0.00%

发文量