Fabrication of sub-micron structures with high aspect ratio for MEMS using deep X-ray lithography

In this paper, we present the fabrication of sub-micron structures with high aspect ratio for practical and high performance microelectromechanical systems (MEMS) using deep X-ray lithography. It is necessary for practical and high performance MEMS to be fabricated microstructures with sub-micron widths and gaps (lines and spaces). In order to fabricate the sub-micron microstructures, sub-micron deep X-ray lithography has been investigated. As a result, a sub-micron PMMA structure with 0.2 /spl mu/m minimum width, 6 /spl mu/m length and 17 /spl mu/m height was fabricated by deep X-ray lithography using an X-ray mask with thick X-ray absorbers having sub-micron width.