基于深亚微米扫描的高速延迟测试研究

Jih-Nung Lee, Ta-Chia Yeh, Chi-Feng Wu, Shih-Arn Hwang, Chao-Cheng Lee
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引用次数: 0

摘要

随着半导体工艺技术的不断进步,越来越多的高频芯片将被设计和制造出来。因此,测试与时间相关的缺陷对于保证高质量的深亚微米产品变得至关重要。本文介绍了基于扫描的高速延迟测试的经验。基于过渡延迟和路径延迟故障模型,对传统的生产测试流程进行了基于扫描的高速延迟测试。为了测试芯片的运行速度,我们设计了一个片上测试时钟发生器来产生高速发射-捕获时钟脉冲。因此,不需要高速测试仪。商业EDA工具用于测试模式生成和时序分析。此外,还提出了应力测试流程,以提高测试质量。实验结果表明,该方法可以检测到延迟缺陷,并与高速功能测试结果相关联
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Experiences In Deep Sub-Micron Scan-Based At-Speed Delay Testing
As semiconductor process technologies keep improving, more and more high frequency chips will be designed and manufactured. Testing of timing-related defects thus is becoming essential to guarantee high quality deep sub-micron products. In this paper, we presented our experiences in scan-based at-speed delay testing. Based on transition delay and path delay fault model, we enhance the traditional production test flow with scan-based at-speed delay tests. To test chips at operational speed, we designed an on-chip test clock generator to generate at-speed launch-capture clock pulses. Therefore, high-speed testers will not be required. Commercial EDA tools are used for test pattern generation and timing analysis. In addition, stress test flow is proposed to enhance the test quality. Experimental results show that our approach can detect delay defects, which can be correlated with results of at-speed functional tests
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