利用激光热工艺,利用理想结型驱动电流增强

T. Yamamoto, K. Goto, Y. Tada, Y. Kikuchi, T. Kubo, Y. Wang, S. Talwar, M. Kase, T. Sugii
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引用次数: 2

摘要

在本文中,我们首次报道了使用激光热处理(LTP)的亚50 nm pmosfet的特性和增强其驱动电流的技术。为了优化sub- 50nm mosfet的工艺,我们研究了LTP的问题,并解决了这些问题。S/ d延伸(SDE)结深度、重叠和片阻由预非晶化离子注入(I/I)能量控制,因此无论掺杂剂量如何,前两个参数都可以控制。这使我们能够设计高度激活和突然的盒状掺杂物轮廓,而不会引起任何短通道劣化。利用该技术,我们在相同的V/sub /-滚降下实现了更高的驱动电流pmosfet,并将45 nm pmosfet的驱动性提高了13%。
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Drive current enhancement by ideal junction profile using laser thermal process
In this paper, for the first time, we report the characteristics of sub-50 nm pMOSFETs using a laser thermal process (LTP) and the technique for enhancing their drive current. For the process optimization required for the technologies of sub-50 nm MOSFETs, we investigated the issues of LTP and cleared them up. S/D-extension (SDE)-junction depth, overlap and sheet resistance were controlled by pre-amorphization ion implantation (I/I) energies, and the first two parameters could be thus controlled regardless of dopant dose. This enabled us to design highly activated and abrupt box-like dopant profiles without inducing any short channel deterioration. With this technique, we achieved higher drive current pMOSFETs for the same V/sub th/-rolloff and a 13% improvement in drivability for 45 nm pMOSFETs.
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