{"title":"基于subblvds接口的低功耗移动相机处理器设计","authors":"C.L. Lee, K. Hsiao, Min-Chung Chou","doi":"10.1109/VDAT.2006.258111","DOIUrl":null,"url":null,"abstract":"A mega pixel image signal processor (ISP) with low voltage differential serial interface is presented. subLVDS interface has lower voltage swing and lower power consumption advantages over a normal LVDS interface. Both subLVDS driver and receiver are implemented in this ISP chip to reduce the I/O pin count. A synchronization layer is designed to cover both non-compressed and compressed image data transfer on the high-speed serial data link. This chip is designed with a pure logic process in 0.18 mum CMOS technology. The subLVDS driver can operate at a transfer rate up to 625Mbps","PeriodicalId":356198,"journal":{"name":"2006 International Symposium on VLSI Design, Automation and Test","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A Low Power Mobile Camera Processor Design with SubLVDS Interface\",\"authors\":\"C.L. Lee, K. Hsiao, Min-Chung Chou\",\"doi\":\"10.1109/VDAT.2006.258111\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A mega pixel image signal processor (ISP) with low voltage differential serial interface is presented. subLVDS interface has lower voltage swing and lower power consumption advantages over a normal LVDS interface. Both subLVDS driver and receiver are implemented in this ISP chip to reduce the I/O pin count. A synchronization layer is designed to cover both non-compressed and compressed image data transfer on the high-speed serial data link. This chip is designed with a pure logic process in 0.18 mum CMOS technology. The subLVDS driver can operate at a transfer rate up to 625Mbps\",\"PeriodicalId\":356198,\"journal\":{\"name\":\"2006 International Symposium on VLSI Design, Automation and Test\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-04-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 International Symposium on VLSI Design, Automation and Test\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VDAT.2006.258111\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 International Symposium on VLSI Design, Automation and Test","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VDAT.2006.258111","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
摘要
提出了一种具有低电压差分串行接口的百万像素图像信号处理器。与普通LVDS接口相比，subLVDS接口具有电压摆幅小、功耗低的优点。为了减少I/O引脚数，在该ISP芯片中实现了subvds驱动程序和接收器。同步层被设计用于覆盖高速串行数据链路上的非压缩和压缩图像数据传输。该芯片采用0.18 μ m CMOS技术，采用纯逻辑工艺设计。subblvds驱动程序可以以高达625Mbps的传输速率运行
A Low Power Mobile Camera Processor Design with SubLVDS Interface
A mega pixel image signal processor (ISP) with low voltage differential serial interface is presented. subLVDS interface has lower voltage swing and lower power consumption advantages over a normal LVDS interface. Both subLVDS driver and receiver are implemented in this ISP chip to reduce the I/O pin count. A synchronization layer is designed to cover both non-compressed and compressed image data transfer on the high-speed serial data link. This chip is designed with a pure logic process in 0.18 mum CMOS technology. The subLVDS driver can operate at a transfer rate up to 625Mbps
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
