预测仿真以提高基于snapback的NMOS钳的可靠性

P. Gaitonde, S. Gaul, T. Crandell, S. Earles
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引用次数: 0

摘要

为了纳入大电流静电放电(ESD)条件,我们扩展了NMOS SPICE模型,以包括寄生BJT,体(衬底)电阻和冲击电离电流的模型。该方法对NMOS的几何和布局依赖性进行建模,使模型具有可扩展性。所建立的模型定性地预测MOS和BJT的触发电压,具有合理的精度。无论MOS通道长度如何,具有较长的本体到源间距的钳形器可以更快地触发寄生BJT。寄生BJT器件参数对钳位导通电压无显著影响
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Predictive simulation to improve reliability of a snapback-based NMOS clamp
To incorporate high current electro-static discharge (ESD) conditions, we have extended a NMOS SPICE model to include models of a parasitic BJT, body (substrate) resistance and impact ionization current. The approach taken models the geometry and layout dependence of the NMOS, making the model scalable. The developed model predicts trigger voltages of MOS and BJT qualitatively and with reasonable accuracy. Clamps having longer body to source spacing are seen to trigger the parasitic BJT faster, irrespective of the MOS channel length. The parasitic BJT device parameters do not have significant effect on the clamp turn-on voltage
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