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引用次数: 37

摘要

利用多晶硅结构作为功能层的微力学技术是生产智能CMOS传感器的一种有前途的技术。其成本和性能优势使其能够满足汽车应用的单片集成传感器等批量市场。利用现代硅工艺及其大规模集成的潜力,芯片上校准和诊断等新功能成为可能。此外,它提供了直接的数字输出信号,这是理想的数据处理在微控制器。在这项技术中,非电功能块(例如压力传感器的膜)可以小型化,这样它们就不会造成芯片空间的损失。这立即大大降低了生产成本。我们将通过两个例子来展示CMOS作为集成传感器技术的优势:集成压力传感器和集成指尖传感器系统。
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Intelligent CMOS sensors
CMOS including micromechanics using polysilicon structures as functional layers is a promising technology for production of Intelligent CMOS Sensors. Its cost and performance advantages allow to address volume markets like monolithic integrated sensors for automotive application. Using modern silicon processes and their potential for large scale integration, new functions like on-chip calibration and diagnosis are possible. Furthermore, it offers direct digital output signals which is ideal for data processing in microcontrollers. In this technology, the non electric functional blocks (e.g. membranes for pressure sensors) can be miniaturized in a way so that they do not impose a chip real-estate penalty. This immediately reduces the production cost immensely. We will demonstrate the superiority of CMOS as technology for integrated sensors by two examples: An integrated pressure sensor and an integrated fingertip sensor system.
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