模拟和混合模式高级集成电路上支持激光局部化软缺陷的方法

Magdalena Sienkiewcz, A. Firiti, O. Crépel, P. Perdu, K. Sanchez, D. Lewis
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引用次数: 1

摘要

由于模拟或混合模式集成电路的复杂性和集成度的不断提高,其软缺陷定位变得越来越具有挑战性。基于动态激光刺激的新技术在模拟和混合模式集成电路中具有广阔的应用前景。不幸的是,这种器件在激光刺激下具有相当大的固有灵敏度,使得缺陷定位结果分析起来很复杂。事实上,激光灵敏度图不仅包含异常敏感区,也包含自然敏感区。为了克服这一问题,通过提取异常点来定位缺陷,本文提出了一种提高分析效率和准确性的方法。它是将测绘结果与激光刺激对设备影响的电学模拟相结合。首先,我们将介绍方法论的概念。然后,我们将展示一个混合模式IC的案例研究,说明使用激光映射技术和标准电气模拟的软缺陷定位。此外,我们将论证一种新方法的兴趣,并将展示我们实验中的两个简单例子来验证它。
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Methodology to support laser-localized soft defects on analog and mixed-mode advanced ICs
The soft defect localization on analog or mixed-mode ICs is becoming more and more challenging due to their increasing complexity and integration. New techniques based on dynamic laser stimulation are promising for analog and mixedmode ICs. Unfortunately, the considerable intrinsic sensitivity of this kind of devices under laser stimulation makes the defect localization results complex to analyze. As a matter of fact, the laser sensitivity mapping contains not only abnormal sensitive regions but also naturally sensitive ones. In order to overcome this issue by extracting the abnormal spots and therefore localize the defect, we propose in this paper a methodology that can improve the FA efficiency and accuracy. It consists on combining the mapping results with the electrical simulation of laser stimulation impact on the device. First, we will present the concept of the methodology. Then, we will show one case study on a mixed-mode IC illustrating the soft defect localization by using laser mapping technique & standard electrical simulations. Furthermore, we will argument the interest of a new methodology and we will show two simple examples from our experiments to validate it.
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