Solder joints stress analysis and optimization of chip component under shear and tensile load based on orthogonal experimental design and gray correlation analysis

The solder joint finite element analysis model of the 0201 chip component was established, by carrying out the shear loading and tensile loading finite element analysis respectively, the stress distribution pattern of the solder joint shear stress and tension stress were obtained. A solder joint stress measurement platform for the chip component was built, the solder joint stress measurement for the chip component under shear load was completed, and the accuracy of the simulation analysis results was verified. Selecting the solder joint volume, pad gap height, and pad length as design variables, and taking the maximum shear and tensile stress of the solder joint as the target, 16 groups of different parameter level combinations were designed by orthogonal test method, and combining with gray correlation analysis method, the bi-objective optimization design of shear and tensile stress of chip component solder joints was carried out—the optimal level combination of shear and tensile stress was obtained and verified by simulation. The results show that the influence ranking of maximum shear stress and tensile stress in solder joints of chip component are both pad gap height, pad length, and solder joint volume. The optimal parameter level combination is the solder joint volume of 0.0147mm${}^2$, pad gap height of 0.05 mm, pad length of 0.35 mm, the maximum shear stress and the maximum tensile stress of the chip component solder joints increase by 44% and 23% respectively after the optimization, enhancing the shear strength and tensile strength of the solder joints in chip component simultaneously.