先进的工艺控制:有利于光刻工艺控制

半导体技术 Pub Date : 2002-08-07 DOI:10.1109/ASMC.2002.1001582

C. Gould

{"title":"先进的工艺控制:有利于光刻工艺控制","authors":"C. Gould","doi":"10.1109/ASMC.2002.1001582","DOIUrl":null,"url":null,"abstract":"High volume, cost effective, manufacturing of state of the art lithography processes requires in depth understanding of Process and Process-Tool interaction to achieve Advanced Process Control (APC). The APC systems being deployed at Infineon Technologies, Richmond has shown and is expected to continue demonstrating continuous improvement for the following primary metrics: /spl middot/ OL and CD Cpk /spl middot/ Rework Reduction /spl middot/ Reduction of MTTD /spl middot/ Lot Cycle Time improvement.","PeriodicalId":64779,"journal":{"name":"半导体技术","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Advanced Process Control: benefits for photolithography process control\",\"authors\":\"C. Gould\",\"doi\":\"10.1109/ASMC.2002.1001582\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"High volume, cost effective, manufacturing of state of the art lithography processes requires in depth understanding of Process and Process-Tool interaction to achieve Advanced Process Control (APC). The APC systems being deployed at Infineon Technologies, Richmond has shown and is expected to continue demonstrating continuous improvement for the following primary metrics: /spl middot/ OL and CD Cpk /spl middot/ Rework Reduction /spl middot/ Reduction of MTTD /spl middot/ Lot Cycle Time improvement.\",\"PeriodicalId\":64779,\"journal\":{\"name\":\"半导体技术\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"半导体技术\",\"FirstCategoryId\":\"1087\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.2002.1001582\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"半导体技术","FirstCategoryId":"1087","ListUrlMain":"https://doi.org/10.1109/ASMC.2002.1001582","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

摘要

大批量、低成本、制造最先进的光刻工艺需要深入了解工艺和工艺-工具的相互作用，以实现先进的过程控制(APC)。在里士满英飞凌技术公司部署的APC系统已经显示出并预计将继续显示出以下主要指标的持续改进:/spl中点/ OL和CD Cpk /spl中点/返工减少/spl中点/ MTTD减少/spl中点/ Lot周期时间改善。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

Advanced Process Control: benefits for photolithography process control

High volume, cost effective, manufacturing of state of the art lithography processes requires in depth understanding of Process and Process-Tool interaction to achieve Advanced Process Control (APC). The APC systems being deployed at Infineon Technologies, Richmond has shown and is expected to continue demonstrating continuous improvement for the following primary metrics: /spl middot/ OL and CD Cpk /spl middot/ Rework Reduction /spl middot/ Reduction of MTTD /spl middot/ Lot Cycle Time improvement.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

半导体技术

自引率

0.00%

发文量

8436

期刊最新文献

A manufacturable shallow trench isolation process for sub-0.2 um DRAM technologies Ultra-dilute silicon wafer clean chemistry for fabrication of RF microwave devices Planarization yield limiters for wafer-scale 3D ICs Statistical modeling and analysis of wafer test fail counts An approach for improving yield with intentional defects