M. Hosseini, G. Martinez, M. H. van der Veen, N. Jourdan, E. Litta, N. Horiguchi
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Automated voids detection for metal filled trenches with bottom CD of 10nm
The focus of this paper is on automatic methodology to detect the sidewall voids in narrow trenches filled by Ru. For this purpose, we applied image processing techniques for image recognition and labeling of images obtained by high-angle-annular-dark-field scanning TEM (HAADF-STEM). Roughly 3300 STEM images of narrow trenches with BCD of 10nm and AR>8 were labeled. This paper demonstrates the versatility and potential of image processing to address the automated void detection in advance MOL applications.
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