M. Hosseini, G. Martinez, M. H. van der Veen, N. Jourdan, E. Litta, N. Horiguchi
{"title":"底部CD为10nm的金属填充沟槽的自动空洞检测","authors":"M. Hosseini, G. Martinez, M. H. van der Veen, N. Jourdan, E. Litta, N. Horiguchi","doi":"10.1109/IITC51362.2021.9537485","DOIUrl":null,"url":null,"abstract":"The focus of this paper is on automatic methodology to detect the sidewall voids in narrow trenches filled by Ru. For this purpose, we applied image processing techniques for image recognition and labeling of images obtained by high-angle-annular-dark-field scanning TEM (HAADF-STEM). Roughly 3300 STEM images of narrow trenches with BCD of 10nm and AR>8 were labeled. This paper demonstrates the versatility and potential of image processing to address the automated void detection in advance MOL applications.","PeriodicalId":6823,"journal":{"name":"2021 IEEE International Interconnect Technology Conference (IITC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Automated voids detection for metal filled trenches with bottom CD of 10nm\",\"authors\":\"M. Hosseini, G. Martinez, M. H. van der Veen, N. Jourdan, E. Litta, N. Horiguchi\",\"doi\":\"10.1109/IITC51362.2021.9537485\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The focus of this paper is on automatic methodology to detect the sidewall voids in narrow trenches filled by Ru. For this purpose, we applied image processing techniques for image recognition and labeling of images obtained by high-angle-annular-dark-field scanning TEM (HAADF-STEM). Roughly 3300 STEM images of narrow trenches with BCD of 10nm and AR>8 were labeled. This paper demonstrates the versatility and potential of image processing to address the automated void detection in advance MOL applications.\",\"PeriodicalId\":6823,\"journal\":{\"name\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-07-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC51362.2021.9537485\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Interconnect Technology Conference (IITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC51362.2021.9537485","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Automated voids detection for metal filled trenches with bottom CD of 10nm
The focus of this paper is on automatic methodology to detect the sidewall voids in narrow trenches filled by Ru. For this purpose, we applied image processing techniques for image recognition and labeling of images obtained by high-angle-annular-dark-field scanning TEM (HAADF-STEM). Roughly 3300 STEM images of narrow trenches with BCD of 10nm and AR>8 were labeled. This paper demonstrates the versatility and potential of image processing to address the automated void detection in advance MOL applications.