半色调移相掩模的FIB和蓝光修复研究

S. Bae, Do-Hwa Lee, Hee-Mok Lee, Myung-Goon Gill, B. Kim, D. Ahn
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引用次数: 1

摘要

我们讨论了在MoSiON相移掩模上采用Ga/sup +/聚焦离子束(FIB)和蓝色激光扫描进行不透明修复的重复修复过程。我们展示了晶片和掩膜基板上的图案保真度和边缘粗糙度。由AIMS工具生成的航拍图像和强度剖面图显示出良好的分辨率。虽然解决了一些问题,但我们必须考虑下一代器件的CD控制规范,例如0.15 /spl mu/m的设计规则。我们用i线和KrF步进器对缺陷修复后的半色调相移掩模的可打印性进行了评估。验证了FIB和蓝色激光修复工具的边缘修复精度、Ga+深度植入效果和环境稳定性。最后,利用原子力显微镜(AFM)和AIMS对修复后的光掩膜形貌进行了测量。
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Investigation of half-tone phase shift mask with FIB and blue laser repair
We discuss a duplicate repairing process for opaque repair by means of a Ga/sup +/ focussed ion beam (FIB) and a blue laser scanning on a MoSiON phase shift mask. We show the pattern fidelity and edge roughness on the wafer and photomask substrates. The aerial images and intensity profiles produced by the AIMS tool show the fine resolution capability. Although somewhat resolved, we must consider the specifications of CD control for next generation devices such as design rules of 0.15 /spl mu/m. We evaluate the printability of the half-tone phase shift mask with i-line and KrF steppers after defect repair. We also confirm the accuracy of edge repair, Ga+ deep implantation effects and the environmental stability of FIB and blue laser repair tools. Finally, we measure the topography of the repaired photomask by AFM and AIMS.
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