{"title":"用于高级互连金属化的铝化物金属间化合物:薄膜研究","authors":"J. Soulie, Z. Tokei, J. Swerts, C. Adelmann","doi":"10.1109/IITC51362.2021.9537441","DOIUrl":null,"url":null,"abstract":"AlNi, Al3Sc, AlCu, and Al2Cu thin films have been investigated as potential alternatives for Cu in interconnect metallization schemes. Stoichiometric NiAl thin films of 56 nm thickness show a resistivity of 13.9 μΩ cm after post-deposition annealing at 600°C. Different capping layers were tested to overcome the formation of an oxide top layer. Al3Sc presents a resistivity of 12.5 μΩ cm after post-deposition annealing at 500°C (for 24 nm thick films). AlCu and Al2Cu outperform Ru films at 20 nm thickness and above (9.5 μΩ cm for 28 nm films). Challenges and integration feasibility are discussed.","PeriodicalId":6823,"journal":{"name":"2021 IEEE International Interconnect Technology Conference (IITC)","volume":"36 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2021-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Aluminide intermetallics for advanced interconnect metallization: thin film studies\",\"authors\":\"J. Soulie, Z. Tokei, J. Swerts, C. Adelmann\",\"doi\":\"10.1109/IITC51362.2021.9537441\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"AlNi, Al3Sc, AlCu, and Al2Cu thin films have been investigated as potential alternatives for Cu in interconnect metallization schemes. Stoichiometric NiAl thin films of 56 nm thickness show a resistivity of 13.9 μΩ cm after post-deposition annealing at 600°C. Different capping layers were tested to overcome the formation of an oxide top layer. Al3Sc presents a resistivity of 12.5 μΩ cm after post-deposition annealing at 500°C (for 24 nm thick films). AlCu and Al2Cu outperform Ru films at 20 nm thickness and above (9.5 μΩ cm for 28 nm films). Challenges and integration feasibility are discussed.\",\"PeriodicalId\":6823,\"journal\":{\"name\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"volume\":\"36 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-07-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC51362.2021.9537441\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Interconnect Technology Conference (IITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC51362.2021.9537441","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Aluminide intermetallics for advanced interconnect metallization: thin film studies
AlNi, Al3Sc, AlCu, and Al2Cu thin films have been investigated as potential alternatives for Cu in interconnect metallization schemes. Stoichiometric NiAl thin films of 56 nm thickness show a resistivity of 13.9 μΩ cm after post-deposition annealing at 600°C. Different capping layers were tested to overcome the formation of an oxide top layer. Al3Sc presents a resistivity of 12.5 μΩ cm after post-deposition annealing at 500°C (for 24 nm thick films). AlCu and Al2Cu outperform Ru films at 20 nm thickness and above (9.5 μΩ cm for 28 nm films). Challenges and integration feasibility are discussed.