用于高级互连的替代金属

2021 IEEE International Interconnect Technology Conference (IITC) Pub Date : 2014-05-20 DOI:10.1109/IITC.2014.6831863

C. Adelmann, L. Wen, A. Peter, Y. Siew, K. Croes, J. Swerts, M. Popovici, K. Sankaran, G. Pourtois, S. Van Elshocht, J. Bommels, Z. Tokei

{"title":"用于高级互连的替代金属","authors":"C. Adelmann, L. Wen, A. Peter, Y. Siew, K. Croes, J. Swerts, M. Popovici, K. Sankaran, G. Pourtois, S. Van Elshocht, J. Bommels, Z. Tokei","doi":"10.1109/IITC.2014.6831863","DOIUrl":null,"url":null,"abstract":"We discuss the selection criteria for alternative metals in order to fulfill the requirements necessary for interconnects at half pitch values below 10 nm. The performance of scaled interconnects using transition metal germanides and CoAl alloys as metallization are studied and compared to conventional Cu and W interconnects.","PeriodicalId":6823,"journal":{"name":"2021 IEEE International Interconnect Technology Conference (IITC)","volume":"31 1","pages":"173-176"},"PeriodicalIF":0.0000,"publicationDate":"2014-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"63","resultStr":"{\"title\":\"Alternative metals for advanced interconnects\",\"authors\":\"C. Adelmann, L. Wen, A. Peter, Y. Siew, K. Croes, J. Swerts, M. Popovici, K. Sankaran, G. Pourtois, S. Van Elshocht, J. Bommels, Z. Tokei\",\"doi\":\"10.1109/IITC.2014.6831863\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We discuss the selection criteria for alternative metals in order to fulfill the requirements necessary for interconnects at half pitch values below 10 nm. The performance of scaled interconnects using transition metal germanides and CoAl alloys as metallization are studied and compared to conventional Cu and W interconnects.\",\"PeriodicalId\":6823,\"journal\":{\"name\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"volume\":\"31 1\",\"pages\":\"173-176\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-05-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"63\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2014.6831863\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Interconnect Technology Conference (IITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2014.6831863","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 63

摘要

我们讨论了替代金属的选择标准，以满足10 nm以下半间距互连所需的要求。研究了以过渡金属锗化物和煤合金为金属化层的规模化互连材料的性能，并与传统的铜、钨互连材料进行了比较。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Alternative metals for advanced interconnects

We discuss the selection criteria for alternative metals in order to fulfill the requirements necessary for interconnects at half pitch values below 10 nm. The performance of scaled interconnects using transition metal germanides and CoAl alloys as metallization are studied and compared to conventional Cu and W interconnects.

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2021 IEEE International Interconnect Technology Conference (IITC)

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