Suhr Dominique, Mevellec Vincent, Thiam Mikailou, Idier Jonathan, Raynal Frédéric, Berthon Hermine, Perrault Elisa, Hann Nicolas, Doussot Céline, Kim Yeeseul, Baus Mathilde, Lakhdari Amine, Guittet Gaëlle, Caillard Louis
{"title":"3D-NAND技术中钨的替代品","authors":"Suhr Dominique, Mevellec Vincent, Thiam Mikailou, Idier Jonathan, Raynal Frédéric, Berthon Hermine, Perrault Elisa, Hann Nicolas, Doussot Céline, Kim Yeeseul, Baus Mathilde, Lakhdari Amine, Guittet Gaëlle, Caillard Louis","doi":"10.1109/IITC51362.2021.9537409","DOIUrl":null,"url":null,"abstract":"As the number of wordlines has reached 128 layers in the realm of 3D-NAND, several challenges have emerged to produce these structures. Among these is metallization of the connection made with Tungsten. This paper explores Nickel alloys as an alternative metal. Several key data are presented to validate this new concept.","PeriodicalId":6823,"journal":{"name":"2021 IEEE International Interconnect Technology Conference (IITC)","volume":"11 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2021-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"An alternative to Tungsten in 3D-NAND technology\",\"authors\":\"Suhr Dominique, Mevellec Vincent, Thiam Mikailou, Idier Jonathan, Raynal Frédéric, Berthon Hermine, Perrault Elisa, Hann Nicolas, Doussot Céline, Kim Yeeseul, Baus Mathilde, Lakhdari Amine, Guittet Gaëlle, Caillard Louis\",\"doi\":\"10.1109/IITC51362.2021.9537409\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As the number of wordlines has reached 128 layers in the realm of 3D-NAND, several challenges have emerged to produce these structures. Among these is metallization of the connection made with Tungsten. This paper explores Nickel alloys as an alternative metal. Several key data are presented to validate this new concept.\",\"PeriodicalId\":6823,\"journal\":{\"name\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"volume\":\"11 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-07-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC51362.2021.9537409\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Interconnect Technology Conference (IITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC51362.2021.9537409","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
As the number of wordlines has reached 128 layers in the realm of 3D-NAND, several challenges have emerged to produce these structures. Among these is metallization of the connection made with Tungsten. This paper explores Nickel alloys as an alternative metal. Several key data are presented to validate this new concept.