阻挡层氮化对铜焊盘电偶腐蚀的影响研究

Xiaodong Li, R. Chockalingam, P. Ang, W. Neo, Juan Boon Tan
{"title":"阻挡层氮化对铜焊盘电偶腐蚀的影响研究","authors":"Xiaodong Li, R. Chockalingam, P. Ang, W. Neo, Juan Boon Tan","doi":"10.1109/IITC51362.2021.9537553","DOIUrl":null,"url":null,"abstract":"Galvanic corrosion of copper bondpad is studied with various copper barrier liner compositions in a unbiased highly accelerated stress test (uhast) condition. It is observed that the delamination at the bimetallic interface between the barrier liner and bulk copper has a strong dependence of N/Ta ratio of the liner. The delamination mechanism is explained and attributed to the galvanic corrosion, due to the presence of electrochemical potential difference between the barrier liner and bulk copper, which is shown to be significantly suppressed by increasing the nitrogen content composition of the liner.","PeriodicalId":6823,"journal":{"name":"2021 IEEE International Interconnect Technology Conference (IITC)","volume":"9 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2021-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A study on the nitridation of barrier liner contribution to galvanic corrosion of copper bondpad\",\"authors\":\"Xiaodong Li, R. Chockalingam, P. Ang, W. Neo, Juan Boon Tan\",\"doi\":\"10.1109/IITC51362.2021.9537553\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Galvanic corrosion of copper bondpad is studied with various copper barrier liner compositions in a unbiased highly accelerated stress test (uhast) condition. It is observed that the delamination at the bimetallic interface between the barrier liner and bulk copper has a strong dependence of N/Ta ratio of the liner. The delamination mechanism is explained and attributed to the galvanic corrosion, due to the presence of electrochemical potential difference between the barrier liner and bulk copper, which is shown to be significantly suppressed by increasing the nitrogen content composition of the liner.\",\"PeriodicalId\":6823,\"journal\":{\"name\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"volume\":\"9 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-07-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC51362.2021.9537553\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Interconnect Technology Conference (IITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC51362.2021.9537553","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

在无偏高加速应力试验(uhast)条件下,研究了不同铜屏障衬里成分对铜键合垫的电偶腐蚀。研究发现,阻挡衬里与大块铜双金属界面处的分层现象与衬里的N/Ta比有很强的相关性。解释了分层机制,并将其归因于电偶腐蚀,这是由于屏障衬里和大块铜之间存在电化学电位差,而增加衬里的氮含量成分可以显著抑制这种电位差。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
A study on the nitridation of barrier liner contribution to galvanic corrosion of copper bondpad
Galvanic corrosion of copper bondpad is studied with various copper barrier liner compositions in a unbiased highly accelerated stress test (uhast) condition. It is observed that the delamination at the bimetallic interface between the barrier liner and bulk copper has a strong dependence of N/Ta ratio of the liner. The delamination mechanism is explained and attributed to the galvanic corrosion, due to the presence of electrochemical potential difference between the barrier liner and bulk copper, which is shown to be significantly suppressed by increasing the nitrogen content composition of the liner.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Contact Interface Characterization of Graphene contacted MoS2 FETs Controlled ALE-type recess of molybdenum for future logic and memory applications Comparison of Copper and Cobalt Surface Reactivity for Advanced Interconnects On-die Interconnect Innovations for Future Technology Nodes Advanced CMP Process Control by Using Machine Learning Image Analysis
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1