用于3nm以上节点互连金属的金属间化合物

2021 IEEE International Interconnect Technology Conference (IITC) Pub Date : 2021-07-06 DOI:10.1109/IITC51362.2021.9537364

J. Koike, Toshihito Kuge, Linghan Chen, M. Yahagi

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引用次数: 1

摘要

我们报道了NiAl和CuAl2金属间化合物代替Cu用于先进节点互连材料的最新研究结果。简要回顾了钴和钌的报道结果，以便进行比较。CuAl2具有低电阻率和良好的TDDB和EM可靠性，是无线和无障碍互连的良好选择。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Intermetallic Compounds For Interconnect Metal Beyond 3 nm Node

We report the recent results of NiAl and CuAl2 intermetallic compounds for advanced-node interconnect materials in place of Cu. Reported results of Co and Ru are briefly reviewed for comparison. CuAl2 can be a good choice in terms of liner-free and barrier-free interconnections having a low resistivity and a good TDDB and EM reliability.

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2021 IEEE International Interconnect Technology Conference (IITC)

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