新型红外/电磁敏感电网设计与分析方法在亚10nm技术节点的最优PPA

Grant Miller, S. Jain, Santosh Kelgeri, Pranav Ranganathan, A. Ceyhan
{"title":"新型红外/电磁敏感电网设计与分析方法在亚10nm技术节点的最优PPA","authors":"Grant Miller, S. Jain, Santosh Kelgeri, Pranav Ranganathan, A. Ceyhan","doi":"10.1109/IITC51362.2021.9537408","DOIUrl":null,"url":null,"abstract":"In this paper, we introduce novel, holistic, electromigration-(EM) and dynamic voltage drop-aware power grid (PG) design and analysis methods that can help resolve the critical limitations that guard-band-driven approaches of today’s modern design closure flows enforce upon physical designers in their quest to achieve the best possible power/performance/area (PPA). These methods can easily be integrated into any existing design flow. The proposed structured strategies to co-optimize inherent trade-offs in PG reliability and PPA improvement can help enable higher transistor density and accurately quantify the impact of IR drop for block-level timing within conventional automatic place-and-route (PnR) flows through the use of an exhaustive, but low-cost in-house solution. We demonstrate up to 9% area savings and up to 5% power reduction while maintaining achievable frequency. The proposed flow updates pave the path for future work to apply our machine-learning-enhanced design space exploration approaches to better control trade-offs between PG reliability and PPA improvement.","PeriodicalId":6823,"journal":{"name":"2021 IEEE International Interconnect Technology Conference (IITC)","volume":"11 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2021-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Novel IR/EM-Aware Power Grid Design and Analysis Methodologies for Optimal PPA at Sub-10nm Technology Nodes\",\"authors\":\"Grant Miller, S. Jain, Santosh Kelgeri, Pranav Ranganathan, A. Ceyhan\",\"doi\":\"10.1109/IITC51362.2021.9537408\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we introduce novel, holistic, electromigration-(EM) and dynamic voltage drop-aware power grid (PG) design and analysis methods that can help resolve the critical limitations that guard-band-driven approaches of today’s modern design closure flows enforce upon physical designers in their quest to achieve the best possible power/performance/area (PPA). These methods can easily be integrated into any existing design flow. The proposed structured strategies to co-optimize inherent trade-offs in PG reliability and PPA improvement can help enable higher transistor density and accurately quantify the impact of IR drop for block-level timing within conventional automatic place-and-route (PnR) flows through the use of an exhaustive, but low-cost in-house solution. We demonstrate up to 9% area savings and up to 5% power reduction while maintaining achievable frequency. The proposed flow updates pave the path for future work to apply our machine-learning-enhanced design space exploration approaches to better control trade-offs between PG reliability and PPA improvement.\",\"PeriodicalId\":6823,\"journal\":{\"name\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"volume\":\"11 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-07-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC51362.2021.9537408\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Interconnect Technology Conference (IITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC51362.2021.9537408","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

在本文中,我们介绍了新颖的、整体的、电迁移(EM)和动态电压降感知电网(PG)设计和分析方法,这些方法可以帮助解决当今现代设计封闭流的保护带驱动方法对物理设计师在追求最佳功率/性能/面积(PPA)时施加的关键限制。这些方法可以很容易地集成到任何现有的设计流程中。所提出的结构化策略可以共同优化PG可靠性和PPA改进的固有权衡,有助于实现更高的晶体管密度,并通过使用详尽但低成本的内部解决方案,准确量化传统自动放置和路由(PnR)流中IR下降对块级时序的影响。在保持可实现的频率的同时,我们展示了高达9%的面积节省和高达5%的功耗降低。提议的流程更新为未来的工作铺平了道路,应用我们的机器学习增强设计空间探索方法来更好地控制PG可靠性和PPA改进之间的权衡。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Novel IR/EM-Aware Power Grid Design and Analysis Methodologies for Optimal PPA at Sub-10nm Technology Nodes
In this paper, we introduce novel, holistic, electromigration-(EM) and dynamic voltage drop-aware power grid (PG) design and analysis methods that can help resolve the critical limitations that guard-band-driven approaches of today’s modern design closure flows enforce upon physical designers in their quest to achieve the best possible power/performance/area (PPA). These methods can easily be integrated into any existing design flow. The proposed structured strategies to co-optimize inherent trade-offs in PG reliability and PPA improvement can help enable higher transistor density and accurately quantify the impact of IR drop for block-level timing within conventional automatic place-and-route (PnR) flows through the use of an exhaustive, but low-cost in-house solution. We demonstrate up to 9% area savings and up to 5% power reduction while maintaining achievable frequency. The proposed flow updates pave the path for future work to apply our machine-learning-enhanced design space exploration approaches to better control trade-offs between PG reliability and PPA improvement.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Contact Interface Characterization of Graphene contacted MoS2 FETs Controlled ALE-type recess of molybdenum for future logic and memory applications Comparison of Copper and Cobalt Surface Reactivity for Advanced Interconnects On-die Interconnect Innovations for Future Technology Nodes Advanced CMP Process Control by Using Machine Learning Image Analysis
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1